Principles of Vapor Deposition of Thin Films 2006
DOI: 10.1016/b978-008044699-8/50005-x
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Cited by 8 publications
(8 citation statements)
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“…Through adjusting the oxygen concentration, TiO 2 nanomembranes with different oxidation degrees can be realized. On the one hand, the pressure of the deposition chamber must be lower than 1.5 × 10 –4 mbar in electron beam deposition to allow passage of electrons from the electron gun to the evaporation material; on the other hand, too low oxygen concentration will produce too high oxygen deficiency, which reduces the total number of redox-active Ti 4+ . Therefore, in this work, a rational oxygen pressure of 1.4 × 10 –4 mbar was used to produce TiO 2 layers having rational Ti 3+ and oxygen vacancies throughout the whole product (which are denoted as TiO 2−δ ).…”
Section: Resultsmentioning
confidence: 99%
“…Through adjusting the oxygen concentration, TiO 2 nanomembranes with different oxidation degrees can be realized. On the one hand, the pressure of the deposition chamber must be lower than 1.5 × 10 –4 mbar in electron beam deposition to allow passage of electrons from the electron gun to the evaporation material; on the other hand, too low oxygen concentration will produce too high oxygen deficiency, which reduces the total number of redox-active Ti 4+ . Therefore, in this work, a rational oxygen pressure of 1.4 × 10 –4 mbar was used to produce TiO 2 layers having rational Ti 3+ and oxygen vacancies throughout the whole product (which are denoted as TiO 2−δ ).…”
Section: Resultsmentioning
confidence: 99%
“…The sample was deposited on a <100> single crystal Si substrate using the Physical Vapour Deposition (PVD) technique. 26 The 99.99% purity solid targets from EVOCHEM GmbH (Offenbach am Main, Germany; Cu) and Testbourne Ltd (Hampshire, England; Zr and Ag) were used in a 3'' sputter magnetron from MANTIS Deposition Ltd (Oxfordshire, United Kingdom). The fabrication conditions are specified in Table S1 (in Supporting Information).…”
Section: Methodsmentioning
confidence: 99%
“…In this approach post-TOF-SIMS measurements of a crater depth with Atomic Force Microscope (AFM 57 ) or Scanning Electron Microscopy (SEM 58 ) are not necessarily needed. A set of three model samples composed of two metals (ZrAl and ZrCu) and a metal-metalloid (ZrSi) forming alloys were produced using the Physical Vapour Deposition (PVD) 59 . 99.99% purity Al, Si and Zr solid targets from Testbourne Ltd (Hampshire, England) and 99.99% purity Cu solid targets from EVOCHEM (Offenbach am Main, Germany) were used in a 3'' sputter magnetron from MANTIS Deposition Ltd (Oxfordshire, United Kingdom) for depositing the thin films with the thickness in the order of 100 nm on <100> single crystal Si wafers under the conditions summarized in Table 1.…”
Section: Experimental Materialsmentioning
confidence: 99%