Thermal evolution, phase composition and fracture toughness of electroless Ni-P, Ni-W-P and Ni-Mo-W-P films for solderable surfaces on copper

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Thermal evolution, phase composition and fracture toughness of electroless Ni-P, Ni-W-P and Ni-Mo-W-P films for solderable surfaces on copper

Cited by 4 publications

References 23 publications

Galvanic replacement deposited copper layer as an efficient activator to realize electroless Ni-P plating on aluminum

Galvanic replacement deposited copper layer as an efficient activator to realize electroless Ni-P plating on aluminum

In-depth investigation of the evolution of microstructure and its influence on the mechanical properties of medium-phosphorus electroless nickel coatings after thermomechanical treatments

Thermal stability and diffusion barrier performance of amorphous Ni-P layer at Sn/Ni-P/Cu interface

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