Thermal expansion of tin in the β–γ transition region

Deshpande, V. T.; Sirdeshmukh, D. B.

doi:10.1107/s0365110x62000742

Cited by 53 publications

(23 citation statements)

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“…While the coordination of Ti in rutile is very close to octahedral, such that the common TiO 4 fragment has SA C H T U N G T R E N N U N G (SP-4) = 0.52, and nearly perfectly tetrahedral in the barium titanate, with SA C H T U N G T R E N N U N G (T-4) = 0.07, in anatase it is a distorted tetrahedron, exactly along the minimal distortion pathway with a generalized coordinate for conversion to the square-planar fragment of the octahedron f T!SP = 34 %. A related situation appears for the Group 14 elements [46] in the b-Sn structure, found also for high-pressure forms of Si, Ge, and Sr, [47] with similar partial conversions from the tetrahedral to octahedral coordination geometry measured by generalized coordinates f T!SP % 56 %.…”

Section: From Tetrahedral To Trans Octahedralmentioning

confidence: 92%

Ligand Association/Dissociation Paths and Ill‐Defined Coordination Numbers

Ruiz‐Martínez

Casanova

Álvarez

2010

Chemistry A European J

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The continuous shape measures approach provides a means for handling the common situation in which a metal atom presents an ill-defined coordination number. Those cases are characterized by the presence of secondary interactions to Lewis bases at distances significantly longer than those expected for a chemical bond. Systematic ways of analyzing ligand association/dissociation pathways that describe such structures and their application to a variety of specific cases are presented. The concepts and methodology presented here apply to molecules and extended solids as well and provide, when needed, a more flexible and precise stereochemical description of the metal coordination sphere than that of an integer coordination number and the associated polyhedral shape.

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Section: From Tetrahedral To Trans Octahedralmentioning

confidence: 92%

Ligand Association/Dissociation Paths and Ill‐Defined Coordination Numbers

Ruiz‐Martínez

Casanova

Álvarez

2010

Chemistry A European J

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“…These data nicely match published data for pure Sn. 28 The c/a ratio for Sn is shown in Fig. 13c, exhibiting a slight increasing trend from 0.546 to 0.548 as the temperature increases from 22°C to 160°C.…”

Section: In Situ Measurements Of Thermal Expansion Of Sn In and Imcsmentioning

confidence: 99%

“…These values are slightly lower than published values for pure Sn, which also shows nonlinear behavior. 28 Expansion of the c lattice parameter yields a CTE of 39.2 9 10 À6 /°C below 80°C, and 57.1 9 10 À6 /°C above 80°C. These data nicely match published data for pure Sn.…”

Section: In Situ Measurements Of Thermal Expansion Of Sn In and Imcsmentioning

confidence: 99%

Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction

Elmer

Specht

2010

Journal of Elec Materi

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The solidification behavior of two low-melting-point metals, Sn and In, on three substrates has been examined using in situ x-ray diffraction. Undercoolings of up to 56.1°C were observed for Sn solidified on graphite, which is a nonwetting substrate, while lower undercoolings were observed for Sn on Au/ Ni/Cu (17.3°C) and on Cu (10.5°C). Indium behaved quite differently, showing undercoolings of less than 4°C on all three substrates. The lattice expansion/ contraction behavior of Sn, In, and intermetallic compounds (IMCs) that formed during the reaction of Sn with Au/Ni/Cu surfaces were also measured during heating and cooling. Results showed anisotropic and nonlinear expansion of both Sn and In, with a contraction, rather than expansion, of the basal planes of In during heating. The principal IMC that formed between Sn and the Au/Ni/Cu surface was characterized as Cu 6 Sn 5 , having an average expansion coefficient of 13.6 9 10 À6 /°C, which is less than that of Sn or Cu.

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“…Lead-free solder alloys have strong anisotropic thermal expansion and plastic deformation characteristics, resulting in mechanical properties that differ significantly from Sn-Pb joints. [12][13][14][15] Compared with Sn-Pb solder joints, each individual lead-free solder joint has its own unique characteristics arising from its anisotropic tetragonal Sn lattice. Because Pbfree solder alloys consist of more than 95% (wt.%) Sn, the mechanical and thermal behavior is dominated by the Sn microstructure.…”

Section: Introductionmentioning

confidence: 99%

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Lee

Liu

Zhou

et al. 2011

Journal of Elec Materi

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The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

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Thermal expansion of tin in the β–γ transition region

Cited by 53 publications

References 0 publications

Ligand Association/Dissociation Paths and Ill‐Defined Coordination Numbers

Ligand Association/Dissociation Paths and Ill‐Defined Coordination Numbers

Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

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