Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Coyle, Richard; Sweatman, Keith; Arfaei, Babak

doi:10.1007/s11837-015-1595-1

Cited by 75 publications

(35 citation statements)

References 31 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In the transition to lead-free electronics, 1 Sn-3.0Ag-0.5Cu (wt.%) (SAC305) has become a widely used commercial solder that can outperform Sn-37Pb joints in thermal cycling. 2 However, the advantages of SAC305 over other compositions diminishes as the severity of the thermal cycle increases 2 and SAC305 often suffers from poor drop impact reliability. 3,4 Therefore, there is a need to better understand the microstructural origin of deformation and failure of SAC305 solder to develop improved solder joints.…”

Section: Introductionmentioning

confidence: 99%

Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder

Gourlay

Britton

2018

Journal of Elec Materi

View full text Add to dashboard Cite

The reliability of solder joints is affected significantly by thermomechanical properties such as creep and thermal fatigue. In this work, the creep of directionally solidified (DS) Sn-3Ag-0.5Cu wt.% (SAC305) dog-bone samples (gauge dimension: 10 9 2 9 1.5 mm) with a controlled <110> or <100> fibre texture is investigated under constant load testing (stress level: $ 30 MPa) at a range of temperatures from 20°C to 200°C. Tensile testing is performed and the secondary creep strain rate and the localised strain gradient are studied by two-dimensional optical digital image correlation (2-D DIC). The dominating creep mechanisms and their temperature dependence are explored at the microstructural scale using electron backscatter diffraction (EBSD), which enables the understanding of the microstructural heterogeneity of creep mechanisms at different strain levels, temperatures and strain rates. Formation of subgrains and the development of recrystallization are observed with increasing strain levels. Differences in the deformation of b-Sn in dendrites and in the eutectic regions containing Ag 3 Sn and Cu 6 Sn 5 are studied and related to changes in local deformation mechanisms.

show abstract

Section: Introductionmentioning

confidence: 99%

Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder

Gourlay

Britton

2018

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…Sn-0.7Cu-0.05Ni has been shown to have higher compliance [1] and higher impact strength [18] compared with high-silver Sn-Ag-Cu (SAC) solders which is important in applications that experience drop impacts. However, Sn-0.7Cu-0.05Ni has lower creep strength and fatigue life in thermal cycling than high-silver SAC solders [19][20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Belyakov

Xian

Sweatman

et al. 2017

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…Reliability of these joints is determined by multiple factors such as shear strength, creep resistance, drop shock, thermal fatigue and vibration resistance. Due to the adoption of the Restriction of Hazardous Substances (RoHS) directives on July 2006, by the European Union (EU), there have been new progress and developments in lead-free solders as a replacement for the conventional lead-based solders for application in the electronics manufacturing industries [1][2][3][4][5]. Amongst the leadfree solders investigated, Sn-Ag and Sn-Ag-Cu (SAC) based solders offer the most promising characteristics as replacement of lead-based solders [6][7].…”

Section: Introductionmentioning

confidence: 99%

Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing

Depiver

Mallik

Harmanto

et al. 2019

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

View full text Add to dashboard Cite

Solder joints of electronic components are the most critical part of any electronic device. Their untimely failure during the system's operation often culminates in catastrophic failure of the device. The determination of creep damage in electronic component solder joint is vital to the prediction of crack initiation and prevention of premature failure. This paper presents the creep damage in solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB) and subjected to thermal cycling as well as isothermal ageing. ANSYS 19.0 package is employed to model the isothermal ageing at-40, 25, 75 and 150℃ temperatures for 45 days. Standard temperature cycle profile is used to simulate the effect of the coefficient of thermal expansion (CTE) mismatch on the bonded materials in the BGA component. The solders studied are lead-based eutectic solder alloy and lead-free SAC396, SAC387, and SAC305. Based on the results obtained for the stress, strain rate, deformation rate and strain energy of the solders, the research investigation advises on the most effective solder for achieving improvement in the thermo-mechanical reliability of solder joints in BGA soldered on PCB.

show abstract

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Cited by 75 publications

References 31 publications

Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder

Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing

Contact Info

Product

Resources

About