Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials 2003
DOI: 10.7567/ssdm.2003.d-8-1
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Thermal Instability of Poly-Si Gate Al2O3 MOSFETs

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“…For a given technology, CMOS devices are designed with a specific gate capacitance, which is proportional to the dielectric constant and inversely proportional to the thickness of the gate material as shown in equation (2 Many materials have been suggested that could replace silicon dioxide or silicon oxynitride as a possible gate dielectric. The most common of these are the simple metal oxides such as Ta 2 O 5 [89][90][91][92][93][94][95][96][97][98][99][100][101][102][103], TiO 2 [104][105][106][107][108][109][110], Y 2 O 3 [111][112][113][114][115][116][117], CeO 2 [118][119][120][121], Al 2 O 3 [122][123][124][125][126][127][128][129][130][131][132], ZrO 2…”
Section: Alternative High-k Gate Dielectricsmentioning
confidence: 99%
“…For a given technology, CMOS devices are designed with a specific gate capacitance, which is proportional to the dielectric constant and inversely proportional to the thickness of the gate material as shown in equation (2 Many materials have been suggested that could replace silicon dioxide or silicon oxynitride as a possible gate dielectric. The most common of these are the simple metal oxides such as Ta 2 O 5 [89][90][91][92][93][94][95][96][97][98][99][100][101][102][103], TiO 2 [104][105][106][107][108][109][110], Y 2 O 3 [111][112][113][114][115][116][117], CeO 2 [118][119][120][121], Al 2 O 3 [122][123][124][125][126][127][128][129][130][131][132], ZrO 2…”
Section: Alternative High-k Gate Dielectricsmentioning
confidence: 99%