Thermal investigation of an infrared reflow oven with a convection fan

Kim, Mi Ro; Choi, Young Ki; Lee, Gyu Bong; Chung, Il Yong; Kim, Jung Duck; Lee, Jun Young

doi:10.1007/bf02945564

Cited by 9 publications

(8 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Although considerable research effort has been directed to the modelling of solder heating during conventional IR reflow [7,8] and subsequent stress in joints [9], there has been relatively little consideration given to the very different behaviour found in laser soldering [10].…”

Section: The Laser Soldering Processmentioning

confidence: 99%

The finite element modelling of laser soldering for electronic assemblies

Beckett

Fleming

Gilbert

et al. 2002

Int J Numerical Modelling

View full text Add to dashboard Cite

SUMMARYThe laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture. The modelling of heating behaviour in typical structures requires consideration of many different phenomena and the resulting models can become complex. The work described here shows that, given appropriate modelling assumptions, finite element models are able to give accurate predictions of heating in high-pin count devices as well as a valuable insight into the important factors affecting the success of laser soldering operations. In particular, it is shown here that conduction through the body of the component being soldered does not significantly affect heating of the solder but that variations in copper track thickness can result in a doubling of the required soldering time. In addition, it is shown that conduction through the printed circuit board is important when using a scanned laser beam to solder multiple joints.

show abstract

Section: The Laser Soldering Processmentioning

confidence: 99%

The finite element modelling of laser soldering for electronic assemblies

Beckett

Fleming

Gilbert

et al. 2002

Int J Numerical Modelling

View full text Add to dashboard Cite

show abstract

“…Moreover, the modelling and simulation of the reflow process provided more information on the particular process when compared to the physical experiment. Son and Shin (2005) and Kim et al (1998) used a 2D numerical model to simulate the multi-mode heat transfer within a forced convection–IR reflow oven and the electronic assembly. From the study, Son and Shin (2005) found that a forced convection–IR reflow oven with a mixture of air injection (air injection up and down) was an effective soldering technique.…”

Section: Challenges In Modelling the Reflow Soldering Processmentioning

confidence: 99%

“…Tavarez and Gonzalez (2003) and Sarvar and Conway (1998) presented a finite difference method (FDM) for predicting the thermal response of solder paste or PCB during the reflow process. Parametric simulations were performed to determine the thermal response of solder paste under different oven operating conditions (Tavarez and Gonzalez, 2003; Kim et al , 1998). Furthermore, Mittal et al (1996) presented a method that coupled the 2D finite element method (FEM) structural and FDM thermal model to predict the thermal response of a PCB assembly during the IR reflow process.…”

Section: Challenges In Modelling the Reflow Soldering Processmentioning

confidence: 99%

“…A simulation tool for the thermal response of a solder joint and flow field prediction of a reflow process was introduced in 1998 (Bailey et al , 1998; Kim et al , 1998). Modelling and simulations of the reflow process provided more information on the particular process and helped the electronic manufacturing industry to solve reliability issues.…”

Section: Direction Of Future Challenges In Reflow Soldering Processmentioning

confidence: 99%

See 1 more Smart Citation

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Lau¹,

Khor

Soares

et al. 2016

SSMT

View full text Add to dashboard Cite

Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

show abstract

“…To improve inaccuracy of the simple model, a detailed numerical model which predicts heat transfer characteristics by solving conduction, convection, and radiation heat transfer equations has been developed (9), (10) , and analysis using this numerical model has been performed (11) . A numerical study reflecting the effect of forced convection by attaching a fan only near the exit of the infrared reflow oven has been performed (12) . However, comprehensive analyses on the forced convectioninfrared reflow soldering process and the effect of the operating conditions on the thermal response of the electronic assemblies have not been performed sufficiently yet.…”

Section: Introductionmentioning

confidence: 99%

Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection

Son

Shin

2005

JSME international journal. Ser. B, Fluids and thermal engineer

View full text Add to dashboard Cite

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied numerically. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven. Forced convection-infrared reflow soldering process with air injection is simulated using a twodimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, air injection velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

show abstract

Thermal investigation of an infrared reflow oven with a convection fan

Cited by 9 publications

References 3 publications

The finite element modelling of laser soldering for electronic assemblies

The finite element modelling of laser soldering for electronic assemblies

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection

Contact Info

Product

Resources

About