Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices

Lewke, Dirk; Dohnke, Karl Otto; Zühlke, Hans Ulrich; Barret, Mercedes Cerezuela; Schellenberger, Martin; Bauer, Anton J.; Ryssel, H.

doi:10.4028/www.scientific.net/msf.821-823.528

Cited by 15 publications

(6 citation statements)

References 1 publication

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“…It would be interesting to expand it from amorphous to crystalline materials where currently microcracks are induced through thermal ablation. [ 25 ]…”

Section: Discussionmentioning

confidence: 99%

Nano‐Cracks and Glass Carving from Non‐Symmetrically Converging Shocks

Gutiérrez‐Hernández

Reese

Reuter

et al. 2023

Advanced Physics Research

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A method is presented to carve into a glass submerged in water with laser‐induced surface and shock waves. It starts with an elliptic wave source that launches an elliptically converging Rayleigh and shock wave. At the wave focus a single microscopic crack with controlled location and orientation is induced that has a length of a few micrometers and a width of about 100 nm. Through successive surface waves, this crack may be extended along a specific direction which can be controlled by adjusting the distance, shape, and orientation of the laser focus. Here, either point‐like or elliptical laser foci are generated using a spatial light modulator. Furthermore, when the crack is guided along a closed circular path using a point like laser focus, a conchoidal hole may be carved through the glass slide demonstrated with a 160 µm thick cover slip. The shock waves are modeled in the fluid and the elastic waves in the glass in three dimensions with a finite‐volume framework that accounts for fluid‐structure interaction. The resulting pressures and stresses for both the elliptical and point‐like Rayleigh and shock wave sources are reported.

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“…It would be interesting to expand it from amorphous to crystalline materials where currently microcracks are induced through thermal ablation. [ 25 ]…”

Section: Discussionmentioning

confidence: 99%

Nano‐Cracks and Glass Carving from Non‐Symmetrically Converging Shocks

Gutiérrez‐Hernández

Reese

Reuter

et al. 2023

Advanced Physics Research

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“…TLS is a kerf free laser based dicing technology [2]. While performing TLS a crack is guided by controlled thermally induced mechanical stress using a continuous wave laser to locally heat up the SiC along the dicing street.…”

Section: Thermal Laser Separation -Tls-dicing Tmmentioning

confidence: 99%

TLS-Dicing for SiC - Latest Assessment Results

Lewke

Barreto

Dohnke

et al. 2018

MSF

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With the gaining demand for SiC semiconductor devices it is more and more challenging to meet the requirements for SiC volume production with the state of the art wafer dicing technology. In order to overcome this challenge the laser based dicing technology Thermal Laser Separation (TLS-DicingTM) was assessed for SiC volume production within the European project SEA4KET. This paper presents the key results of this project. It could be demonstrated that the demand of SiC volume production regarding throughput and cost as well as edge quality and electrical performance of diced chips can be met with TLS-DicingTM.

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“…However, this method has low cutting efficiency, high cutting loss, and often results in chipping and unevenness of the cut edges [7]. To solve the cutting problem of SiC, the world's leading semiconductor companies and research institutions [8][9][10] are actively pursuing the development of laser processing technology to replace mechanical cutting. Laser scribing of SiC reduces damage due to thermal effects compared to direct laser dicing of SiC, which is also a favorable method to process SiC.…”

Section: Introductionmentioning

confidence: 99%

Cohesive behavior of single crystalline silicon carbide scribing by nanosecond laser

Chen,

Li,

Pan

et al. 2024

Preprint

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The existing mechanical dicing process of single crystalline Silicon Carbide (SiC) is one of the main factors limiting the development of semiconductor process, which could be replaced by laser dicing potentially. However, the zones of ablation damage generated by high power laser should be well controlled. When wafer is only scribed with a thin groove by laser, thermal effect could be reduced significantly. The while scribing process includes laser grooving and subsequent mechanical cracking. The mechanical cracking by force is critical to determine the finishing quality, and spallation or irregular cross-section may be obtained if the cracking process is uncontrolled. The initiation and propagation of the crack are related to the geometry of scribed groove and the melted layer in the groove. To achieve efficient and low-damage SiC separation, the cracking behavior of SiC after laser grooving should be addressed and controllable. Since the laser grooving including thermal ablation and meltage solidification, the cracking behavior of the scribed SiC would be different to the original single crystal SiC. In this paper, cohesive zone model (CZM) is used to quantitively represent the cracking behavior of the scribed SiC. Nanosecond laser with different processing parameters is adopted to scribe SiC substrate with different geometries of grooves. To capture the cohesive behavior of the scribed SiC during cracking, the whole separation of the SiC was conducted in a three-point bending (3PB) fixture. Therefore, by inverting the load-displacement curves of 3PB with CZM embedded finite element model (FEM), the cohesive behavior is characterized by bilinear traction-separation law, which illustrated the whole cracking process numerically. The methodology established in current paper gives way to understand the SiC scribing and cracking process with quantitative cohesive parameters.

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Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices

Cited by 15 publications

References 1 publication

Nano‐Cracks and Glass Carving from Non‐Symmetrically Converging Shocks

Nano‐Cracks and Glass Carving from Non‐Symmetrically Converging Shocks

TLS-Dicing for SiC - Latest Assessment Results

Cohesive behavior of single crystalline silicon carbide scribing by nanosecond laser

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