2006
DOI: 10.1016/j.ijsolstr.2005.05.009
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Thermal loading in multi-layered and/or functionally graded materials: Residual stress field, delamination, fatigue and related size effects

Abstract: The stress field and fracture propagation due to thermal loading in multi-layered and/or functionally graded composite materials are extensively analysed. Regarding fracture, we have focused the attention on delamination between the layers due to brittle or fatigue thermally induced crack propagations. The statically indeterminate stress analysis is solved coupling equilibrium, compatibility and constitutive equations. Fracture analysis is based on the classical GriffithÕs criterion rewritten for composite str… Show more

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Cited by 24 publications
(12 citation statements)
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“…The longitudinal displacements w of two adjacent layers i and i + 1 at the ith common interface can be computed as follows (see also [23]), i = 1, . .…”
Section: Shear-deformable Interfacesmentioning
confidence: 99%
See 3 more Smart Citations
“…The longitudinal displacements w of two adjacent layers i and i + 1 at the ith common interface can be computed as follows (see also [23]), i = 1, . .…”
Section: Shear-deformable Interfacesmentioning
confidence: 99%
“…To fix ideas, let us consider as a representative example the case of two layers, which was also analyzed in [23]. In this case, we have only one compatibility equation:…”
Section: Shear-deformable Interfacesmentioning
confidence: 99%
See 2 more Smart Citations
“…Residual stresses are instead generated during the bonding process and are usually caused by a uniform temperature distribution. From the theoretical point of view, it is important to notice that the problem of residual stresses induced by a hot bonding of two material components during the fabrication process can be considered equivalent, neglecting the algebraic sign, to the problem of thermal stresses induced by a temperature increase in a bonded two-material structure [35]. As a consequence, the problem of residual stresses induced in the elements by a temperature increase T can be studied as the problem of thermal stresses due to a temperature decrease of the same absolute amount.…”
Section: Numerical Modelling Of Thermo-elastic and Residual Stressesmentioning
confidence: 99%