Thermal Management Challenges in Telecommunication Systems and Data Centers

Abstract

Abstract -The framework for this paper is the growing concern about the worldwide increasing energy consumption of telecommunications systems and data centers, and particularly the contribution of the thermal management system. The present energy usage of these systems is discussed, as well as the relationship between cooling system design and the total cost of ownership. The paper identifies immediate and future thermal bottlenecks facing the industry, ranging from technological issues at the component and system level to more general needs involving reliability, modularity and multidisciplinary design. Based on this enumeration, the main challenges to implementing cooling solutions are reviewed. Particular attention is paid to implementing liquid cooling, since this technology seems the most promising to addressing the key thermal bottlenecks, and improving the future sustainability of thermal management in the telecom and data center industry. Finally, an outlook is presented towards future potential challenges.

Thermal Management Roadmap for Energy Efficient Next Generation Telecommunications Equipment

“…al. (21,22) presented a detailed discuss about the thermal management and energy efficiency challenges in telecommunication systems and data centers. Though the papers are mainly focusing at the high level discussions on the importance of the energy efficiency of telecommunication equipment and data centers, however, it does include a vast of data and information useful to the thermal engineers in these areas.…”

Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

“…The heat fluxes range from ~1 MW/cm 2 for nanoscale IC heat sources at ~1 nm length scales to ~1 W/cm 2 for IC packages at ~1 mm length scales [9]. For heat spreading applications, diamond has an exceptionally high conductivity.…”

“…A number of recent publications have addressed the thermal management challenges in large-scale electronics systems, including those by the authors [1,2] that were based on prior workshops in this series organized by the Cooling Technologies Research Center, a National Science Foundation Industry/University Cooperative Research Center at Purdue University. Because of the growing energy consumption by large-scale electronic systems and the data center sector in particular [1], thermal management challenges in this sector have received a lot of attention in recent research and review papers [3,4].…”

Experimental and Numerical Study of Indirect Free Cooling in an Exothermic Building

“…These equipment operate with a high power density and requires important energy supplying. Most of this energy is converted into heat and dissipated in the interior volume [1]. Therefore, the use of a cooling system becomes very essential to respect the classes of temperatures and humidity fixed by the ASHRAE standards [2].…”