Thermal management of high-power electronics modules packaged with interconnected parallel plates

Haque, S.; Xing, Kun; Suchicital, Carlos; Nelson, Douglas; Lu, Gang; Borojevic, D.; Lee, F.C.

doi:10.1109/stherm.1998.660395

Cited by 9 publications

(9 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Changes of convection coupling will be induced when the thermal environment is changed in the converters. Due to these factors, thermal convection cannot be ignored [18], and the thermal models should incorporate the convection thermal coupling resistances (R cvcp ) among the heating components. These thermal models in the literature ignore the effect of convection coupling [19].…”

Section: Thermal Models In a Boost Converter Systemmentioning

confidence: 99%

Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

Wei

Tian

et al. 2019

Applied Sciences

View full text Add to dashboard Cite

In relation to power converter design, power density is increasing while the form factor isdecreasing. This trend generally reduces the rate of the cooling process, which increases the mutualthermal coupling among the surrounding power components. Most of the traditional modelsusually ignore the mutual effects or just focus on the conduction coupling. To deal with these factors,the thermal modeling for a boost converter system has been built to compare the junctiontemperatures (Tj) and the increments under different working conditions in order to consider theconduction coupling. A multi-variable thermal resistances model is proposed in this paper toincorporate the convection thermal coupling into the mutual thermal effects. The couplingresistances, MOSFET to the diode[...]

show abstract

Section: Thermal Models In a Boost Converter Systemmentioning

confidence: 99%

Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

Wei

Tian

et al. 2019

Applied Sciences

View full text Add to dashboard Cite

show abstract

“…These failures usually occur at the heel of the wire bond -where the most stress occurs [145,146]. The thermal resistance of the wire bonds also increase at high currents and temperatures [61,147].…”

Section: Interconnectsmentioning

confidence: 99%

Integrated motor drives: state of the art and future trends

2017

IET Electric Power Applications

View full text Add to dashboard Cite

With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented. IntroductionOver the last two decades there has been a shift from traditional physically separated motor and drive systems to more compact, power dense, motor-drive combinations [1]. This new power-dense motor-drive structure combines both the motor and its associated control and drive circuitry within a single enclosure. The earliest records of commercially available motor-drive systems were manufactured by Grundfos in 1991 and Franz Morat KG in 1993 [2].These compact systems have been called a variety of names from 'smart motors' to 'integrated motors', the latter forming the foundation for the new moniker currently identified with these systems [3]. The term 'integrated motor drive (IMD)' is the latest associated with this class of products and is as a result of the success of a TB Woods Inc. manufactured motor-drive registered under the same name [3].IMDs are increasingly being developed and produced by machine manufacturers due to the significant potential benefits they offer. The most significant of these benefits include direct replacement of inefficient direct on line motors, increased power density, lower losses and lower costs compared with separate motor and drive solutions. Technological advancements over the last decade have led to the development of robust electronic components able to withstand the harsh environments required by some forms of integration [4]. By eliminating separate enclosures and long cable runs, the integrated approach promises to lower system costs by 20 to 40% [5].Elimination of transmission cables has economic advantages, including increased reliability due to the removal of the output filter commonly required for long cables. Removal of long cable runs and integration into a single package will also significantly reduce potential electromagnetic interference (EMI). This a...

show abstract

“…Also, large electromagnetic fields are generated as currents pass through adjacent wires, thus creating uneven current distributions among the wires. Another disadvantage of wire-bonds is that all cooling must occur through the bottom of the die, which greatly restricts heat dissipation from the module [84]. This, combined with the localization of current flowing into the top of the device, creates hot spots on the top surface of the die at each wirebond.…”

Section: Figure 13mentioning

confidence: 99%

“…This is due both to wire flexure fatigue resulting from the wide ambient temperature swings in automotive environments and to wire liftoff resulting from the creation of these hot spots and high thermal gradients at the wirebondto-die interface at the top of the device. Additionally, the large solder area of the bond can fatigue and delaminate under thermal cycling [84] resulting in poor heat transfer over large areas of the attach under the die. This increases the temperature of the hot spots above these areas, accelerating wire liftoff failure.…”

Section: Figure 13mentioning

confidence: 99%

Power Modulation Investigation for High Temperature (175-200 degrees Celcius) Automotive Application

McCluskey¹

2007

View full text Add to dashboard Cite

Thermal management of high-power electronics modules packaged with interconnected parallel plates

Cited by 9 publications

References 4 publications

Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

Integrated motor drives: state of the art and future trends

Power Modulation Investigation for High Temperature (175-200 degrees Celcius) Automotive Application

Contact Info

Product

Resources

About