Thermal management of LED with vapor chamber and thermoelectric cooling

Ong, Kok Seng; Tan, Chee Fai; Lai, KC; Tan, Kia Hock; Singh, Ranjit

doi:10.1109/iemt.2016.7761956

Cited by 5 publications

(1 citation statement)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This however creates an issue to the effective thermal management when a large amount of heat is generated on the small surface area [3]. Different methods were proposed to meet the high heat flux requirements including the use of thermoelectric and vapor chamber [4][5][6][7]. Recently, the use of microchannel heat sink is drawing researchers' attention for dissipating high heat flux and cooling high power microelectronics owing to its higher efficient over the traditional heat sink [8].…”

Section: Introductionmentioning

confidence: 99%

Effect of Microfins on Thermal Performance of Microchannel Using CFD

Yeo¹,

Yeap²,

Lai³

et al. 2018

IJET

View full text Add to dashboard Cite

In the present study, the fluid flow and heat transfer characteristic of microchannel heat sink with microfins are studied numerically at Reynold number ranging from 400 to 1200. The influence of microfins on the Nusselt number and pressure drop are investigated. Five different types of microfins namely cylindrical microfins (Case A), diverge cylindrical microfins (Case B), diverge cylindrical microfins with semi-circle rib (Case C), diverge cylindrical microfins with rectangular rib (Case D) and diverge cylindrical microfins with triangular rib (Case E) are designed. A comparative analysis of these five types of microfins with bare microchannel has been conducted. The result highlighted the extended microfins augmented the heat transfer characteristic by disrupt the thermal boundary layer. The overall thermal performances of microchannel heat sink with microfins are 1.1 – 1.47 times higher compared to bare microchannel.

show abstract