Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

Tariq, Hussain Ahmed; Ahmad, Hafiz Waqar; Hassan, Mehdi; Anwar, Muhammad

doi:10.1007/s10973-018-7852-0

Cited by 15 publications

(8 citation statements)

References 44 publications

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“…A reduction of 9.1% in base temperature was noticed using CuO-water nanofluids as compared to water at 1 Lpm. A reduction of 14.1% in base temperature was recorded by Tariq et al [36] using CuO-water nanofluids in cellular structure as compare to water. The maximum value of base temperature was recorded as 53.7 °C for 1.5 mm fin spacing heat sink at the flow rate of 0.5 Lpm.…”

Section: Base Temperature With Flow Ratementioning

confidence: 87%

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Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

et al. 2020

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Original scientific paper https://doi.org/10.2298/TSCI180722022AWater cooled heat sinks are becoming popular due to increased heat generation inside the microprocessor. Timely heat removal from microprocessor is the key factor for better performance and long life. Heat transfer enhancement is reached either by increasing the surface area density and/or by altering the base fluid properties. Nanoparticles emerge as a strong candidate to increase the thermal conductivity of base fluids. In this research, the thermal performance of mini-channel heat sinks for different fin spacing (0.2 mm, 0.5 mm, 1 mm, and 1.5 mm) was investigated numerically using CuO-water nanofluids with volumetric concentration of 1.5%. The numerical values computed were than compared with the literature and a close agreement is achieved. We recorded the minimum base temperature of chip to be 36.8 °C for 0.2 mm fin spacing heat sink. A reduction of 9.1% in base temperature was noticed using CuO-water nanofluids for 0.2 mm fin spacing as compared to previously experimental estimated value using water [1]. The drop percentage difference in pressure between water and CuO-water nanofluids was 2.2-13.1% for various fin spacing heat sinks. The percentage difference in thermal resistance between water and CuO-water nanofluids was computed 12.1% at maximum flow rate. We also observed uniform temperature distribution for all heat sinks.

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Section: Base Temperature With Flow Ratementioning

confidence: 87%

“…Tariq et al [34][35][36] performed numerical and experimental study on cellular structure to evaluate thermal performance using air, water and nanofluids as a coolant. The lowest temperature they achieved in their experimental study was; 47.4 °C for air, 32.3 °C for water, 26.6 °C for Al 2 O 3 -water and 27.7 °C for CuO-water.…”

Section: Introductionmentioning

confidence: 99%

Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

et al. 2020

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“…A noticeable average performance factor of 2.68 was obtained for the simultaneous utilization of corrugated minichannels and Al 2 O 3 /water nanofluid inside a heat sink (Khoshvaght-Aliabadi and Sahamiyan, 2016). Tariq et al (2019) investigated the thermal performance of a micro-hole cellular structure using Al 2 O 3 -water and CuO-water nanofluids with 0.67 and 0.4 vol %, respectively. The thermal conductivities of Al 2 O 3 and CuO nanofluids were enhanced by 2 and 1.19%, respectively, as compared to the pure water.…”

Section: Cooling Applicationsmentioning

confidence: 99%

A Review on Heat Transfer Enhancement With Nanofluids

Guo

2020

J Enh Heat Transf

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Advances in technology miniaturization with increasing power density call for new technologies for enhancing heat transfer. Enhancement of heat transfer with the use of nanofluids has been a hectic topic of research and development since the term "nanofluid" was first used in 1995, mainly because the thermophysical properties of nanofluids in most reports in the literature showed supremacy or improvement over their base fluids, which may not allow fulfillment of the present cutting-edge technology needs. Significant progress in this field has been made in the past two decades. This review summarizes a variety of the experimentally measured thermal properties of common nanofluids, the enhancement mechanisms discovered or hypothesised, the models used for properties and heat transfer characteristics, and the applications of nanofluids for enhancing heat transfer. The model of an artificial neutral network is particularly emphasized. Applications to cooling technology, renewable energy and energy systems, and building technology are detailed. Challenges and areas for future research are identified.

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“…Roshani et al [12] performed thermal investigation of the pin fin heat sink using TiO 2 -H 2 O and Al 2 O 3 -H 2 O nanofluid. They reported that by using 2% volumetric concentration, heat transfer increased by 14% and 16% respectively using Al 2 O 3 -H 2 O as well as TiO 2 -H 2 O. Tariq et al [13] carried out thermal investigation on microelectronic devices using nanofluids. They reported that by using CuO-H 2 O and Al 2 O 3 -H 2 O nanofluids 1.19% and 2% enhancement in thermal conductivity was observed when compared with water.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance of dual flow slotted fin mini channel heat sink using Al₂O₃-H₂O and TiO₂-H₂O: a numerical and experimental approach

Baig

Adil

Manzoor³

et al. 2023

Nanotechnology

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Water cooled mini channels have gained importance because of high heat generation inside the microprocessors. This generated heat needs to be timely removed for maintaining the durability and performance of the microprocessor. This work proposes a two-pronged strategy for thermal performance enhancement of mini channel heat sinks. Firstly, a novel dual flow slotted fin mini channel heat sink flow configuration is proposed. Secondly, a detailed numerical investigation is performed to assess heat transfer enhancement property of Al2O3-H2O and TiO2-H2O nanofluids. Considering the first step, fin spacing, number of slots, slot thickness and slot angle are investigated in detail yielding to the selection of best structural parameters. Further, numerical assessment of nano fluid behavior is carried out at volumetric concentrations of 0.005% and 0.01%. For the case of novel dual flow slotted fin mini channel heat sink, maximum numerical and experimental reduction in base temperature and thermal resistance is observed for Al2¬O3-H2O nano fluid at volumetric concentration of 0.01%, as compared with water. Increment in the pressure drop is noted with increasing volumetric concentrations.

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Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

Cited by 15 publications

References 44 publications

Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

A Review on Heat Transfer Enhancement With Nanofluids

Thermal performance of dual flow slotted fin mini channel heat sink using Al₂O₃-H₂O and TiO₂-H₂O: a numerical and experimental approach

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Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

Cited by 15 publications

References 44 publications

Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

A Review on Heat Transfer Enhancement With Nanofluids

Thermal performance of dual flow slotted fin mini channel heat sink using Al2O3-H2O and TiO2-H2O: a numerical and experimental approach

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Thermal performance of dual flow slotted fin mini channel heat sink using Al₂O₃-H₂O and TiO₂-H₂O: a numerical and experimental approach