Components and Packaging for Laser Systems VIII 2022
DOI: 10.1117/12.2608551
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Thermal management optimization in high-power 3D sensing VCSELs

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“…The double-layer reflow microchannel heat dissipation system is shown in figures 8(c) and (d). In the same year, Filipchuk et al presented a method for improving heat sinking by packaging VCSEL arrays onto aluminum nitride (AIN) submounts and subsequently encapsulating them in a thermally conductive and optically transparent epoxy [117]. This encapsulation led to a 20% decrease in thermal resistance and a 17% increase in measured power.…”
Section: Temperature Stability and Reliabilitymentioning
confidence: 99%
“…The double-layer reflow microchannel heat dissipation system is shown in figures 8(c) and (d). In the same year, Filipchuk et al presented a method for improving heat sinking by packaging VCSEL arrays onto aluminum nitride (AIN) submounts and subsequently encapsulating them in a thermally conductive and optically transparent epoxy [117]. This encapsulation led to a 20% decrease in thermal resistance and a 17% increase in measured power.…”
Section: Temperature Stability and Reliabilitymentioning
confidence: 99%