2023 24th European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2023
DOI: 10.23919/empc55870.2023.10418328
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Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction

Sheikh Hassan,
Pushparajah Rajaguru,
Stoyan Stoyanov
et al.

Abstract: This paper presents parametric model order reduction (pMOR) by the Lagrange approach of matrix interpolation for the thermal-mechanical and reliability study of a power electronics module (PEM) with nonlinear behaviours. Most previous research in model order reduction (MOR) studies reports thermal-mechanical simulations using a sequentially coupled method. In this research, a direct-coupled thermal-mechanical analysis, which simultaneously solves the thermal and structural governing equations, has been used to… Show more

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