Thermal, mechanical and antibacterial properties of cyclophosphazene incorporated benzoxazine blended bismaleimide composites

Krishnadevi, Krishnamoorthy; Selvaraj, V.; Shivaramu, Prasanna D.

doi:10.1039/c4ra10564h

Cited by 46 publications

(29 citation statements)

References 80 publications

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“…17,18 Hence, DGEBA epoxy resin and benzoxazine (Bz) 19 were mixed with 15 wt% of amineterminated cyclotriphosphazene and various weight percentages (1, 3 and 5%) of functionalized rice husk ash ( Table 1). 17,18 Hence, DGEBA epoxy resin and benzoxazine (Bz) 19 were mixed with 15 wt% of amineterminated cyclotriphosphazene and various weight percentages (1, 3 and 5%) of functionalized rice husk ash ( Table 1).…”

Section: Synthesis Of Flame Retardant Compositesmentioning

confidence: 99%

Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

Krishnadevi

Selvaraj

2015

New J. Chem.

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The present study is focused on the synthesis and characterization of flame retardant amine-terminated cyclophosphazene and silane functionalized rice husk ash reinforced benzoxazine blended epoxy composites as a halogen-free flame retardant material (ATCP/FRHA/Bz-Ep). FT-IR spectroscopy, scanning electron microscopy (SEM), X-ray diffraction analysis, contact angle measurements, dielectric constant, DSC, TGA, UL-94, LOI and cone calorimetry were used to characterize the surface morphology as well as the structural, electrical, thermal and flame retardant properties of the resultant ATCP/FRHA/Bz-Ep composite material. The experimental results suggested that ATCP/FRHA/Bz-Ep composites exhibit better flame retardant and dielectric performance compared to that of a neat Bz-Ep material. A plausible mechanism of the fire retardant ATCP/FRHA/Bz-Ep composite material is hypothesized based on the results of cone calorimetric, thermal and electrical analysis. From the abovementioned results, it was concluded that the ATCP/FRHA/Bz-Ep composite can be used as an electrical resistant material for electronic and microelectronic applications.

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Section: Synthesis Of Flame Retardant Compositesmentioning

confidence: 99%

Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

Krishnadevi

Selvaraj

2015

New J. Chem.

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“…The intensity of CH 2 peaks appearing in FBz is more intense as compared with that of SBz representing the presence of long alkyl chain of stearylamine. The appearance of peaks at 918 and 1504 cm −1 indicate the presence of benzene ring attached with oxazine ring . While the peak appeared at 1101 cm −1 corresponds to symmetric stretching vibrations of C─N─C for both FBz and SBz, the peaks present at 1223 and 1143 cm −1 represent the C─O─C bond in benzoxazine ring.…”

Section: Resultsmentioning

confidence: 98%

Development and characterization of fully bio‐based polybenzoxazine‐silica hybrid composites for low‐k and flame‐retardant applications

Krishnadevi

Devaraju

Eeda

et al. 2019

Polymers for Advanced Techs

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In the present work, new classes of bio‐based polybenzoxazines were synthesized using eugenol as phenol source and furfurylamine and stearylamine as amine sources separately through solventless green synthetic process routes and were further reinforced with varying percentages (1, 3, 5, and 10 wt%) of silica (from rice husk) to attain hybrid composites. The molecular structure, cure behaviour, thermal stability, dielectric properties, and flame‐retardant behaviour of both benzoxazine monomers and benzoxazine composites were characterized using appropriate modern analytical techniques. The eugenol‐based benzoxazines synthesized using furfurylamine (FBz) and stearylamine (SBz) were cured at 223°C and 233°C, respectively. The differential scanning calorimetry (DSC) data reveal the glass transition temperatures (Tg) of FBz and SBz were 157°C and 132°C, respectively, and the maximum decomposition temperature (Tmax) as obtained from thermogravimetric analysis (TGA), were found to be 464°C and 398°C for FBz and SBz, respectively. The dielectric constants for FBz and SBz obtained at 1 MHz were 3.28 and 3.62, respectively. Furthermore, varying weight percentages (1, 3, 5, and 10 wt%) of 3‐mercaptopropyltrimethoxysilane (3‐MPTMS) functionalized bio‐silica reinforced the composite materials as evidenced by their improved thermal stability and lower dielectric constant. Data obtained from thermal and dielectric studies suggested that these polybenzoxazines could be used in the form of adhesives, sealants, and composites for high performance inter‐layer low‐k dielectric applications in microelectronics.

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“…Figure shows the dependence of dielectric constant and dielectric loss on frequency for various molar ratios of BMI/3‐APN/GF composite laminates at room temperature. The dielectric properties of cured polymers usually depend on the orientation and relaxation of dipoles which is accompanied by the movement of polymer chain segments . The BMI/3‐APN/GF composite laminates show a good stability on its dielectric constant over a wide frequency range from 1 kHz to 200 kHz.…”

Section: Resultsmentioning

confidence: 99%

“…The dielectric properties of cured polymers usually depend on the orientation and relaxation of dipoles which is accompanied by the movement of polymer chain segments. 30 The BMI/3-APN/GF composite laminates show a good stability on its dielectric constant over a wide frequency range from 1 kHz to 200 kHz. It is worth mentioning that the electrical properties on composite laminates are affected by the content of BMI.…”

Section: Mechanical Property Of Bmi/3-apn/gf Composite Laminatesmentioning

confidence: 95%

Curing behavior and processability of BMI/3‐APN system for advanced glass fiber composite laminates

Huang

Jiang

et al. 2016

J of Applied Polymer Sci

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The prepolymers containing bismaleimide (BMI) and 3-aminophenoxyphthalonitrile (3-APN) were prepared through simple solution prepolymerization, and the corresponding curing behaviors and processability were investigated by differential scanning calorimetry and dynamic rheological analysis. The results showed that the processability of the prepolymers could be controlled by temperature and time on processing, also depended on the relative content of 3-APN and BMI. The possible curing reactions of the prepolymers were studied by Fourier transform infrared spectroscopy, which involved the Michael addition between BMI and 3-APN and self-polymerization of BMI or 3-APN. The resulting polymers displayed high thermo-oxidative stabilities (T 5% > 425 8C) and good adhesion capability. Furthermore, BMI/3-APN systems were employed to prepare BMI/3-APN/glass fiber (GF) composite laminates and their morphological, mechanical, and electrical stable properties were also investigated. The BMI/3-APN/GF laminates exhibited the improvement of the mechanical properties (the maximum flexural strength is 633.5 MPa and flexural modulus is 38.7 GPa) compared with pristine BMI/GF laminates because of the strong interfacial adhesions between GF and matrices, which was confirmed with SEM observations. This study provides a concise strategy for diversifying the preparation of BMI/3-APN prepolymers to obtain advanced GF composite laminates with various properties which have potential applications in industrial manufacture or electronic circuit, and so on.

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Thermal, mechanical and antibacterial properties of cyclophosphazene incorporated benzoxazine blended bismaleimide composites

Abstract: Cyclophosphazene is incorporated in to Bz–Bmi composites in order to improve the thermal, mechanical, electrical resistance and antibacterial properties of CP–Bz–Bmi composite.

Cited by 46 publications

References 80 publications

Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

Development and characterization of fully bio‐based polybenzoxazine‐silica hybrid composites for low‐k and flame‐retardant applications

Curing behavior and processability of BMI/3‐APN system for advanced glass fiber composite laminates

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