Thermal modeling of electrical contacts in switches and relays

Leung, C.H.; Lee, A.; Wang, Bor-Jenq

doi:10.1109/holm.1995.482882

Cited by 9 publications

(5 citation statements)

References 6 publications

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“…When the current flows through the connection part, the temperature of contact area will rise higher than the other part of the buses [1][2] . Under some extreme condition such as short-circuit current (over DC 15000A), temperature rising will cause arc and fusion welding and will damage to the thermal stability and electrodynamic force stability of the bus [3][4] . Therefore, temperature rise needs to be analyzed for the design and test of NSPB.…”

Section: Introductionmentioning

confidence: 99%

Steady Temperature Rise Analysis of Non Segregated Phase Bus Based on Finite Element Method

You

Liang

et al. 2012

2012 IEEE 58th Holm Conference on Electrical Contacts (Holm)

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In the design and analysis of Non Segregated Phase Bus (NSPB), steady temperature rise calculation is very important especially for the bolt-joint contact structure NSPB. In order to ensure the safety of such products, taking a certain type of NSPB for example, finite element method (FEM) calculation model of NSPB is built based on thermal transfer theory, the maximum temperature rise of NSPB is calculated under different DC and AC loads within the bus working range, the temperature distribution of contact area is simulated; and the temperature correspondence relationship of DC-AC is discussed; the NSPB temperature rise has been tested and compared with the experiment results, the validity of NSPB FEM calculation is verified.

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Section: Introductionmentioning

confidence: 99%

Steady Temperature Rise Analysis of Non Segregated Phase Bus Based on Finite Element Method

You

Liang

et al. 2012

2012 IEEE 58th Holm Conference on Electrical Contacts (Holm)

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“…Contact degradations: The change of movable/stationary contact feature with arc erosion or corrosion [1]. Therefore, accurate thermal analysis results of contact degradation will mainly rely on the breakthrough of the electrical contacts physics.…”

Section: Introductionmentioning

confidence: 99%

“…While many computer programs basing on FEM are available to build up complex 3-dimensional models well, such as ANSYS, NASTRAN, MARC, but there are unique problems in applying these programs to model hermetically sealed electromagnetic relays. The challenges are: a. Constriction resistance properties: Joule losses in the moving/stationary contact [1]. The constriction regions of contacts with different geometry shape and its current density are the most important parameters that affect thermal loads and thermal contact resistance.…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis of hermetically sealed electromagnetic relay in high and low temperature condition

Ren

Liang

Zhai

2006

Electrical Contacts - 2006. Proceedings of the 52nd IEEE Holm Conference on Electrical Contacts

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Hermetically sealed structure is the optimal style to protect electromagnetic relay (EMR) from formidable working environment. Each product shall be subjected to thermal environment shock in accordance with MIL-STD-202 from -65°C to +125°C temperature, so it is of great importance for thermal analysis of EMR to increase the thermal stability and reliability requirement. In this paper, special finite element analysis (FEM) software ANSYS, was used for the accurate simulation of the internal relay structure. The elevated temperature characteristic of relay is investigated considering comprehensive thermal conductivity and convection effect. Internal complex heat transfer paths of EMR are determined and the influence of different temperature condition of inert gas on thermal performance is also researched. The results of the analysis can be useful for reliability thermal design of hermetically sealed EMR.Key Words-hermetically sealed electromagnetic relay, thermal analysis, high and low temperature, finite element method (FEM)

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“…CAE methods are used to more accurately estimate the thermal interface resistance, which is very important in any thermal analysis program. 3…”

Section: Introductionmentioning

confidence: 99%

Measurement, Control and Evaluation of Low-Power Contactor Switches under Overload Current

Rodriguez-Rodrigez

Guevara-Gordillo

Gomez-Sanchez

et al. 2014

Measurement and Control

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Load rating of contactor switches is an important issue for diverse industrial power applications requiring varied connections. This paper presents a simple procedure to evaluate the current-carrying capabilities of contactor switches under overload cyclic stress. An experimental setup is proposed to measure test current, contact voltage drop, and temperature at the contacts and cable connectors. Results are presented for ON–OFF controlled commutated current at 500% and 1000% overload of a contactor in the ON position. The attained results and the criteria for contactors selection in power applications are given.

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Thermal modeling of electrical contacts in switches and relays

Cited by 9 publications

References 6 publications

Steady Temperature Rise Analysis of Non Segregated Phase Bus Based on Finite Element Method

Steady Temperature Rise Analysis of Non Segregated Phase Bus Based on Finite Element Method

Thermal analysis of hermetically sealed electromagnetic relay in high and low temperature condition

Measurement, Control and Evaluation of Low-Power Contactor Switches under Overload Current

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