Thermal performance of a thin flat vapor chamber with a multiscale wick fabricated by SAC305/Sn58Bi micro-sized particles

Kang, Seo Yeon; Kim, Sung Hyoun; Park, Jiyeon; Jang, Seok Pil

doi:10.1016/j.ijheatmasstransfer.2023.124305

Cited by 8 publications

(1 citation statement)

References 17 publications

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“…In contrast, the coolants inside the passive cooling packages are solitarily driven by the temperature gradient and the capillary force. The typical passive embedded cooling packages contain the vapor chamber (VC, a passive phase change heat transfer device) [25][26][27] . Associated with the wick structures, the evaporation/condensation circulation in the VC can rapidly remove the heat flux from hotspots and achieve hightemperature uniformity on the hotspot surfaces 28,29 .…”

Section: Introductionmentioning

confidence: 99%

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

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Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation.

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