Thermal Performance of LED Filament in Flip-Chip Packaging Manufactured for Different Correlated Color Temperature

Abstract

The effect of correlated color temperature (CCT) on the thermal performance of light emitting diode (LED) filament in flip-chip packaging was investigated in detail. Two filaments with different lengths were selected as the research object, and the thermal resistance of filaments under three CCT (2200 K, 2400 K, 2700 K) were studied. The optical properties and thermal parameters of the two groups of filaments were measured, and the results were analyzed combined with the color coordinate. The experimental results show that thermal properties of LED filaments is closely related to CCT. Under constant current condition, junction temperature decreases with the increase of color difference. With the change of phosphor glue and phosphorus powder ratio, the color temperature of LED filament also changes. In the filaments with the same chip structure and packaging mechanism, the higher the proportion of red phosphorescent powder, the worse the heat dissipation performance of the filament. These results show that in the design and manufacture of LED filament, it is helpful to control the CCT of LED filament under the premise of meeting the use requirements.