Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

Abstract

We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through successful completion of the following tasks: patterning copper micropillar wick structures on PCB, mechanical design and fabrication of condenser, device sealing, and device vacuuming and charging with working fluid. Two prototype vapor chambers with distinct micropillar array designs are fabricated, and their thermal performance tested under various heat inputs supplied from a 2 mm × 2 mm heat source. Thermal performance of the device improves with heat inputs, with the maximum performance of ∼20% over copper plated PCB with the same thickness. A three-dimensional computational fluid dynamics/heat transfer (CFD/HT) numerical model of the vapor chamber, coupled with the conduction model of the packaging substrate is developed, and the results are compared with test data.

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

“…The size of the vapor chamber was 40 mm× 40 mm, composed of two top and bottom plates based on the silicon wafer and filled with degassed DI water as the working fluid. To simulate the performance and measure the temperature, a 10 mmx10 mm platinum heater was fabricated, and the experiment was performed within 40 W. The silicon vapor chamber showed the highest heat transfer performance at a heat flux of 15 W/cm 2 , and the heat resistance at this time was Cho and Joshi [49] developed a vapor chamber integrated with a microelectronic substrate on the printed circuit board (PCB). The prototype vapor chambers were designed, fabricated, and sealed with 40 mmx40 mmx1.3 mm and had two distinct Cu micropost wick structures.…”

Capillary-Assisted Evaporation/Boiling in PDMS Microchannel Integrated with Wicking Microstructures

“…Micropillar diameters in this range have been successfully investigated in capillary vapor chambers using wicking structures . The micropillar dimensions and arrangement are similar to the study of copper micropillar wicking structures by Cho et al and result in a porosity of 0.57. The width and pitch of the vapor pathways are 100 and 325 μm, respectively.…”