2017
DOI: 10.1016/j.applthermaleng.2016.10.090
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Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction

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Cited by 279 publications
(68 citation statements)
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“…In order to avoid heat loss to the ambient, the boundary of the shell is adiabatic. The ratio of the fin volume to the volume between the inner tube and shell holds constant with a value of 10% to achieve the optimal thermal enhancement . In this context, the amount of PCM in LHS units is identical for both the tree‐shaped fin case and wheel‐shaped fin case, which means the maximal energy charging or discharging capacity of LHS units in the present study is the same.…”
Section: Mathematical Modelsmentioning
confidence: 88%
“…In order to avoid heat loss to the ambient, the boundary of the shell is adiabatic. The ratio of the fin volume to the volume between the inner tube and shell holds constant with a value of 10% to achieve the optimal thermal enhancement . In this context, the amount of PCM in LHS units is identical for both the tree‐shaped fin case and wheel‐shaped fin case, which means the maximal energy charging or discharging capacity of LHS units in the present study is the same.…”
Section: Mathematical Modelsmentioning
confidence: 88%
“…The lower thermal conductivity of OPCMs reduces the rate of heat transfer, which causes increase in temperature gradient and insensitivity to temperature changes across the system boundaries. OPCMs, with potential advantage as TES materials, are being developed for applications including air conditioning, ie, natural air cooling, cold thermal storage and absorption refrigeration, waste heat recovery, solar energy storage, thermal regulating fabric, passive heating of building, heat pipes, desalination, thermal management of electronic devices and electric vehicle batteries, spacecraft, and other integrated thermal control systems such as trombe wall, PCM‐filled wallboards, shutter, concrete, under floor heating systems, ceiling boards, and hot water supply . However, the leakage issue and lower thermal conductivity of OPCMs causes harm with interacting medium and results in energy efficiency losses of the thermal system.…”
Section: Introductionmentioning
confidence: 99%
“…To store and release the latent thermal energy, lots kinds of resins are used to encapsulate the organic PCMs and prevent its leakage, such as high density polyethylene, silicone rubber, and polyethylene terephthalate [15][16][17]. However, these methods will increase the thermal resistance of PCMs.…”
Section: Introductionmentioning
confidence: 99%