2018
DOI: 10.1007/s00542-018-3829-y
|View full text |Cite
|
Sign up to set email alerts
|

Thermal performance optimization of Si micro flat heat pipes by Box–Behnken design

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(1 citation statement)
references
References 31 publications
0
1
0
Order By: Relevance
“…Németh et al developed a compact model to represent the convective heat transfer with a particular resistor network for thermal management of 3D ICs. Passive cooling equipment like micro–heat pipe device was experimentally investigated by Hamidnia et al for thermal management of microelectronics packages. Jadhav et al numerically investigated microchannel heat sinks with pin fins in the channel.…”
Section: Introductionmentioning
confidence: 99%
“…Németh et al developed a compact model to represent the convective heat transfer with a particular resistor network for thermal management of 3D ICs. Passive cooling equipment like micro–heat pipe device was experimentally investigated by Hamidnia et al for thermal management of microelectronics packages. Jadhav et al numerically investigated microchannel heat sinks with pin fins in the channel.…”
Section: Introductionmentioning
confidence: 99%