Thermal Plasma Decomposition of Fluorinated Greenhouse Gases

Repurposing of F-gases: challenges and opportunities in fluorine chemistry

“…A few studies available in the open literature have focused specifically on HFC-134a destruction. 86–91 One study carried out experiments using a tubular-type furnace to explore the important features of HFC-134a thermal decomposition. They concluded that with a temperature above 800 °C, sufficient O 2 and an auxiliary fuel (H 2 O or CH 4 ), HFC-134a reacts to produce HF, H 2 O and CO 2 .…”

Chemical reaction mechanism of plasma scrubber for by-product treatment in TiN-atomic layer deposition processes

“…The substituted TiO 2 is collected in the powder trap, and the remaining byproducts, except TiO 2 , are moved to the scrubber through the pump. 9) One potential problem of PPS is the generation of hydrochloric acid (HCl), which is corrosive to the chamber and exhaust. HCl is formed from the reaction of Cl 2 , which is produced during the formation of TiO 2 in the oxygen plasma, and the hydrogen dissociated from NH 3 .…”

Characteristic study of decomposing CF4 in a nitrogen microwave plasmas torch at atmospheric pressure

“…As far as plasma abatement technologies are concerned, there are inductively coupled plasma (ICP) [9][10][11][12], dielectric barrier discharge (DBD) or in combination with catalyst [1], pulsed corona discharge (PCD) [13,14], arc plasma discharge (APD) [15][16][17][18][19][20], surface wave plasma (SWP) [21][22][23][24], and microwave plasma torch (MPT) [25][26][27][28][29][30][31]. To degrade PFCs, some of them are suitable for operating at low pressure, such as ICPs, and the others at atmospheric pressure, such as DBD, PCD, SWP, APD, and MPT.…”

“…In contrast, the atmospheric-pressure plasma discharges in degrading PFCs demands less equipment investment and its operating costs are relatively low, and the most remarkable is that the postpump abatement is usually employed at atmospheric pressure, which obviously has a lot of merits, such as entirely transparent to process chamber, less corrosive to equipment, and easy to maintain, etc [23]. At present, the arc plasma discharge (APD) is most developed and widely applied to degrade PFCs in semiconductor industry [15][16][17]. However, the erosion of electrodes and high consumption of electric power when using the APD demands it to be improved in future applications.…”