“…The plasma here is generated using a dc arc torch, operating at about 200 A current and 8-10 kW power. For SiC synthesis [7][8][9][10]13,14], SiCl 4 vapour and methane are injected into an argon-hydrogen plasma, with typical flow rates of 30-35 slm argon, 2-6 slm hydrogen, 40 sccm SiCl 4 , and methane flow rates ranging up to 15 times the SiCl 4 flow rate. Substrate temperatures have typically been in the range 750-900 • C. While the highest hardness measured for SiC nanoparticle films deposited by HPPD, 37.3 GPa [15], is well above the ∼28 GPa value for commercial SiC wafers, that result was anomalous, with more typical values lying around 22 GPa [16].…”