Thermal Prediction of Convective-Radiative Porous Fin Heatsink of Functionally Graded Material Using Adomian Decomposition Method

Oguntala, George; Sobamowo, M. G.; Yinusa, A. A.; Abd‐Alhameed, Raed A.

doi:10.3390/computation7010019

Cited by 14 publications

(19 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Different methodologies including analytical, numerical, and experimental have been reported in the literature on heat transfer enhancement using nanofluids, porous media, geometry, and heat load and surface roughness . Montgomery used FloTherm to computationally investigate the effect of particle deposition on the efficiency of a solid pin fin array.…”

Section: Introductionmentioning

confidence: 99%

Effects of particle fouling and magnetic field on porous fin for improved cooling of consumer electronics

2019

Self Cite

View full text Add to dashboard Cite

The combined effect of particulate fouling and magnetic field on the efficiency of a convective-radiative porous fin heatsink with temperature-dependent thermal conductivity is presented. The developed thermal models are solved using differential transformation method. The effects of thermal conductivity, porosity, convection, radiation parameter, and thermal fouling number on the fin thermal efficiency are investigated. The presence of thermal fouling on the surface of the fin is shown to increase the temperature distribution. The presence of particle deposition on the fin surface significantly decreases the rate of heat transfer as additional thermal resistance of the fouling layer decreases the thermal performance of porous fin heatsink. Moreover, the fin efficiency decreases as the value of fouled Biot, Darcy, radiation number, and thermogeometric parameter increases. It is established that M f < M c , which indicates that the efficiency of the fouled fin is greater than the efficiency of the clean fin. Furthermore, the result of the present study is validated with the established results of Chebyshev spectral collocation method and fourth-order Runge-Kutta with shooting method and an error margin of 0.000000023 is established.K E Y W O R D S differential transformation method, particle fouling, porous fin, thermal analysis

show abstract

Section: Introductionmentioning

confidence: 99%

Effects of particle fouling and magnetic field on porous fin for improved cooling of consumer electronics

2019

Self Cite

View full text Add to dashboard Cite

show abstract

“…where ψ is a digamma function, γ is the Euler-Masheroni constant, and csgn is a sign function for real and complex expressions. It is worth stating that the determination of inverse Laplace transforms for Equations ( 25)- (27) would result in a high computational cost, which is overcome numerically using Simon's approach 41 as follows:…”

Section: Present Solution: Integral Transform Methodsmentioning

confidence: 99%

“…Functionally graded materials (FGMs) are nonhomogeneous materials of varying physical properties along a specific axis. FGM is popular due to its effective capability in a wide variety of applications, which necessitate the intense attention the investigation of fins of FGM is receiving in the literature 22‐29 …”

Section: Introductionmentioning

confidence: 99%

“…FGM is popular due to its effective capability in a wide variety of applications, which necessitate the intense attention the investigation of fins of FGM is receiving in the literature. [22][23][24][25][26][27][28][29] To this end, different new numerical and analytical methods have been proposed in the literature on the subject of thermal improvement using fins. [30][31][32][33][34][35][36][37][38] The main objective of the present work is to study the thermal behavior of a [Correction added on 30 May 2020, after first online publication: The word "porous" has been removed from this sentence] fin made of FGM under the influence of Lorentz force to develop thermally viable heat dissipating devices.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Transient analysis of functionally graded material fin under the effect of Lorentz force using the integral transform method for improved electronic packaging

2020

Self Cite

View full text Add to dashboard Cite

In the present work, transient analysis of longitudinal fin of functionally graded material under the influence of Lorentz force is considered. The governing equations of the linear, quadratic, and exponential functions are solved via Bessel, Legendre, and modified Bessel functions, respectively. The study investigates the effects of Lorentz force on the performance of the fin. The study shows that the transient response of the fin is lower in the linear law function compared with the exponential law function. The power law function shows significant energy‐saving capability than the linear class functionally graded material heatsink. Moreover, the thermal characteristic of the fin improves with an increase in the convective, radiative, magnetic field parameter, and nonhomogeneous index. The temperature prediction of the present study using the integral transform method is verified with the fourth‐order Runge‐Kutta method with an excellent agreement established.

show abstract

“…The design and structure of microchannels have a significant impact on hydraulic and thermal performance of heatsinks. In the last 50 years, much effort has been devoted to enhance the heat dissipation ability of heatsinks in respect to the heatsink materials and fabrication methods [1][2][3], different arrangements of equipment in cooling loops and systems [4], optimization tools [5], different coolants [6], different phases of coolants [7,8], combination of thermoelectric coolers and heatsinks [9], compact sandwiched press-pack SiC power module [10], using nanofluids [11], heat exchangers designs [12], using porous materials in heatsinks [13] and different channel shapes and designs [14].…”

Section: Introductionmentioning

confidence: 99%

A Modification of Offset Strip Fin Heatsink with High-Performance Cooling for IGBT Modules

2020

View full text Add to dashboard Cite

For reliability and thermal management of power devices, the most frequently used technique is to employ heatsinks. In this work, a new configuration of offset strip fin heatsink based on using the concept of curvy fins and U-turn is proposed with the aim of improving the heat transfer performance. With this aim, a three-dimensional model of heatsink with Silicon Insulated-Gate Bipolar Transistors (IGBTs) and diodes, solder, Direct Bonded Copper (DBC) substrate, baseplate and thermal grease is developed. Richardson’s extrapolation is used for increasing the accuracy of the numerical simulations and to validate the simulations. To study the effectiveness of the new offset design, results are compared with conventional offset strip fin heatsink. Results show that in aspects of design of heatsinks (including heat transfer coefficient, maximum chip temperature and thermal resistance), the new introduced model has advantages compared to the conventional offset strip fin design. These enhancements are caused by the combination of the longer coolant passage in the heatsink associated with generation of disturbance and recirculation areas along the curvy fins, creation of centrifugal forces in the U-turn, and periodic breaking up boundary layers. Also, it is shown that due to narrower passage and back-and-forth route, the new introduced design can handle the hot spots better than conventional design.

show abstract

Thermal Prediction of Convective-Radiative Porous Fin Heatsink of Functionally Graded Material Using Adomian Decomposition Method

Cited by 14 publications

References 25 publications

Effects of particle fouling and magnetic field on porous fin for improved cooling of consumer electronics

Effects of particle fouling and magnetic field on porous fin for improved cooling of consumer electronics

Transient analysis of functionally graded material fin under the effect of Lorentz force using the integral transform method for improved electronic packaging

A Modification of Offset Strip Fin Heatsink with High-Performance Cooling for IGBT Modules

Contact Info

Product

Resources

About