2010
DOI: 10.1002/pat.1832
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Thermal properties and flame retardancy of novel epoxy based on phosphorus‐modified Schiff‐base

Abstract: Through addition reaction of Schiff‐base terephthalylidene‐bis‐(p‐aminophenol) (DP‐1) and diethyl phosphite (DEP), a novel phosphorus‐modified epoxy, 4,4'‐diglycidyl‐(terephthalylidene‐bis‐(p‐aminophenol))diphosphonate ether (EP‐2), was obtained. An modification reaction between EP‐2 and DP‐1 resulted in an epoxy compound, EP‐3, possessing both phosphonate groups and CN imine groups. The structure of EP‐2 was characterized by Fourier transform infrared (FTIR), elemental analysis (EA), 1H, 13C, and 31P NMR ana… Show more

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Cited by 42 publications
(28 citation statements)
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“…The weight loss of the phosphonated foams in the temperature range 320–440 °C is about 70 wt% whereas for PU F4811 foam an increase of about 80 wt% can be registered. This is probably due to the fact that the degradation of the phosphonate groups at a relatively low temperature leads to the formation of an organophosphorus char that prevents degradation of the remaining polymer. However, in the temperature range 440–520 °C the phosphonated foams undergo another rapid weight loss.…”
Section: Resultsmentioning
confidence: 99%
“…The weight loss of the phosphonated foams in the temperature range 320–440 °C is about 70 wt% whereas for PU F4811 foam an increase of about 80 wt% can be registered. This is probably due to the fact that the degradation of the phosphonate groups at a relatively low temperature leads to the formation of an organophosphorus char that prevents degradation of the remaining polymer. However, in the temperature range 440–520 °C the phosphonated foams undergo another rapid weight loss.…”
Section: Resultsmentioning
confidence: 99%
“…As typical thermosetting plastic, epoxy thermoset was often processed with various curing agents to form steady three‐dimensional mesh structure, generally possessing excellent electrical insulation, chemical corrosion resistance, sealing performance, and remarkable dimensional stability . Hence, epoxy thermosets have been widely applied in various industry fields, such as electrical insulation materials, printed circuit board, adhesive, mobile phone materials, surface coating, and so on . However, the flammability of epoxy thermoset limited its applications in most advanced materials .…”
Section: Introductionmentioning
confidence: 99%
“…As one of the most common thermosetting resins, epoxy resins (EPs) are subjected in many applications as adhesives and matrix resins . Although EPs possess outstanding adhesion, chemical resistance, and mechanical and electrical insulating properties, EPs are highly flammable, which greatly restricts their applications in many fields where good flame retardancy is required .…”
Section: Introductionmentioning
confidence: 99%