Thermal Properties of epoxy composites with silicon carbide and/or graphite

Kim, Jungsoo; Kim, Jae Won; Nam, Dae Geun; Bae, Jong‐Sup; Yeum, Jeong Hyun; Oh, Weontae

doi:10.3938/jkps.68.551

Cited by 8 publications

(6 citation statements)

References 12 publications

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“…However, when inorganic oxide filler such as alumina is used together with graphite, it serves to supplement the heat transfer path in the vertical direction between the graphite particles oriented in the plane direction. 21,22 In addition, as seen from the thermal conductivity equation described in the previous experimental part, the density of a composite is proportional to the thermal conductivity. A composite mixed with heterogeneous particles of various structures and sizes can form a dense morphology, resulting in the dense composite.…”

Section: Resultsmentioning

confidence: 97%

“…This can be explained as the results of the blocking of the heat transfer path due to interfacial thermal resistance between heterogeneous particles and the inefficiency of heat transfer are perpendicular to the orientation of graphite within the TIM composite. 21,22 Table 2 summarizes the thermal conductivity of TIM samples containing natural graphite with different particle sizes. Each graphite species was ultrasonicated under the optimal condition of 450 W and 30 min which was studied above, and then, the thermal conductivity was measured on the TIMs of the same composition containing the as-treated graphite.…”

Section: Resultsmentioning

confidence: 99%

“…In general, graphite has a high intrinsic thermal conductivity and the use of graphite is effective in improving the thermal conductivity of a composite, but reduces the mechanical properties of the composite when it is used excessively. 22 Therefore, it is effective to mix graphite with inorganic fillers to optimize the thermal conductivity and the mechanical properties of the resulting composite. The dotted lines in the figures indicated the thermal conductivity of TIMs made by using AlN (70 wt%) or alumina (80 wt%) alone, and was displayed to compare it with the experimental results.…”

Section: Resultsmentioning

confidence: 99%

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Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

Bae

Moon

2021

Journal of Composite Materials

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The microstructural change of graphite was studied after ultrasonic treatment of the graphite. When the graphite solution was treated with varying ultrasonic power and time, the microstructure changed gradually, and accordingly, the thermal conductivity characteristics of the composite containing the as-treated graphite was also different with each other. Thermal conductivity showed the best result in the silicone composite containing graphite prepared under the optimum condition of ultrasonic treatment, and the thermal conductivity of the composite improved proportionally along with the particle size of graphite. When the silicone composite was prepared by using a mixture of inorganic oxides and graphite rather than graphite alone, the thermal conductivity of the silicone composite was further increased. A silicone composite containing graphite was used for LED (light emitting diode) lighting system as a thermal interface material (TIM), and the temperature elevation due to heat generated, while the lighting was actually operated, was analyzed.

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Section: Resultsmentioning

confidence: 97%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

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Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

Bae

Moon

2021

Journal of Composite Materials

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“…One interesting possibility was to introduce inorganic ceramics as conductive fillers. In applications, that require both thermally conductive and electrically insulating materials, fillers like boron nitride (BN) [6][7][8][9], aluminium nitride (AlN) [10,11], silicon nitride (Si 3 N 4 ) [12][13][14] or silicon carbide (SiC) [2,15,16] can be used in composite manufacturing [2,17]. For the applications where the electrical insulation is not required, thermally conductive additives, like graphite [16], graphene [18,19], metal particles, and carbon nanotubes [17,18] can be used.…”

Section: Introductionmentioning

confidence: 99%

Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides

Sądej

Gojżewski

Gajewski

et al. 2018

Express Polym. Lett.

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Boron nitride (BN) and silicon nitride (Si 3 N 4) are very promising particulate fillers for production of photocurable composites dedicated to thermally conductive and electrically insulating protective coatings. Composites containing crosslinked methacrylate-based matrices filled with BN or Si 3 N 4 (in amounts up to 5 wt%) were prepared in a fast in situ photocuring process with high conversion (>90%). The monomers were polyethylene glycol dimethacrylate and monomethacrylate (50/50 by weight mixture). Investigations included determination of properties of the monomer/filler compositions, photocuring kinetics and thermal, conductive and mechanical properties of the resulting composites. It was found that addition of the fillers improves polymerization kinetics and mechanical properties compared to the pure polymer matrix. Despite the very low loading level a substantial improvement in thermal conductivity was obtained: a 4-fold increase after addition of only 2 wt% of Si 3 N 4 and 2.5-fold increase after addition of 0.5 wt% of BN. SEM and AFM imaging (with nanoscopic Young's modulus determination) revealed good matrix-filler adhesion for the both types of fillers, tendency of the particles to be preferentially located in the bulk rather than at the interface and formation of thermally conducting paths (for the Si 3 N 4 filler).

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“…However, due to polyvinyl alcohol, formaldehyde and abrasive were used as the main raw material [4] in polyvinyl alcohol resin grinding wheels, they tend to suffer from issues of high toxicity, low strength,and high processing costs. In order to overcome these drawbacks, the epoxy foam resin grinding wheel were prepared in this study.It is well known that epoxy resins have been shown excellent comprehensive performance [5] , so epoxy resin were regarded as binder .For the abrasive, silicon carbide was selected for its outstanding wear resistance, thermal conductivity and thermal stability [6] .…”

Section: Introductionmentioning

confidence: 99%

The Development of Epoxy Foam Resin Grinding Wheel

Liang¹,

Shuiyuan²

2016

Proceedings of the 2016 2nd International Conference on Advances in Energy, Environment and Chemical Engineering (AEECE 2016)

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In this study,grafting modification silicon carbide powders were manufactured successfully by KH-550 and acrylamide monomer in nitrogen atmosphere, and the modified silicon carbide epoxy foam resin grinding wheels were prepared by mixing epoxy resin with silicon carbides. The structure of the modified silicon carbide was characterized by using scanning electron microscopy(SEM) and laser particle size distribution analyzer.The cross section morphology of the resin grinding wheels with different types of blowing agents were observed by optical microscope. Besides, the mechanical properties, lifespan and grinding performance of resin grinding wheel were systematically analyzed and studied with different dosage of blowing agent. The results were shown that mechanical properties were related to greatly the blowing agent content. The lifespan and grinding performance both initially increased with blowing agent, but begin to decrease after exceeding a certain value.Their maximum values were obtained when 8-wt% OBSH blowing agent,the lifespan is 89h, the grinding ratio is 70.20 and abrasion rate is 0.00025.

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Thermal Properties of epoxy composites with silicon carbide and/or graphite

Cited by 8 publications

References 12 publications

Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides

The Development of Epoxy Foam Resin Grinding Wheel

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