Thermal Properties of Polyimide Composites with Nanostructured Silicon Carbide

Abstract

A series of polyimide composites reinforced with different loadings of silicon carbide (SiC) nanoparticles are prepared by in-situ polymerization technique. The polyimide (PI) matrix resin is derived from 4,4'-oxydianiline (4,4'-ODA) and pyromellitic dianhydride (PMDA). The dispersions of SiC nanoparticles are prepared via ultrasonic irradiation or mechanical homogenization. In this method, the SiC nanoparticles are dispersed in diamine solution followed by polymerization with dianhydride. The composites obtained under sonication were found to have lower thermal properties than composites prepared under homogenization.

Effect of micro‐ and nanofiller hybrids on the dynamic mechanical properties of glass reinforced epoxy composites

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Thermal conductivity and mechanical properties of polyimide composites with mixed fillers of BN flakes and SiC@SiO2 whiskers

“…The glass transition temperature ( T g ) determined by DMA analysis is summarized in Table and also increases with increasing filler content. PI composites exhibit enhanced thermal stability likely due to the good thermal stability of SiC ceramic whiskers and the restricted movement of PI chain by incorporated mixed fillers …”

Ullmann Reaction Optimization within Bitolyl and Decafluorobiphenyl Synthesis

“…Aromatic polyimides have been paid great attention in the microelectronics as interlayer dielectrics due to their properties, including high thermal stability, chemical resistance and good mechanical and electrical properties. In particular, polyimides, which are stable at high temperature, are producing by condensing diamine and pyromellitic 24 anhydrite.…”