Thermal Resistance and Impedance Calculator (TRIC)

Codecasa, Lorenzo; Viti, Francesca De; Race, Salvatore; d’Alessandro, V.; Gualandris, Donata; Morelli, Arianna; Villa, Claudio Maria

doi:10.1109/therminic.2019.8923605

Cited by 6 publications

(2 citation statements)

References 46 publications

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“…In the field of thermal management, detailed finite element models and multiphysics simulations are developed to predict the behavior of a system with high accuracy. From these detailed descriptions, reduced-order models are constructed which guide thermal design and system-level integration [1].…”

Section: Introductionmentioning

confidence: 99%

Quantitative Performance Comparison of Thermal Structure Function Computations

2021

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The determination of thermal structure functions from transient thermal measurements using network identification by deconvolution is a delicate process as it is sensitive to noise in the measured data. Great care must be taken not only during the measurement process but also to ensure a stable implementation of the algorithm. In this paper, a method is presented that quantifies the absolute accuracy of network identification on the basis of different test structures. For this purpose, three measures of accuracy are defined. By these metrics, several variants of network identification are optimized and compared against each other. Performance in the presence of noise is analyzed by adding Gaussian noise to the input data. In the cases tested, the use of a Bayesian deconvolution provided the best results.

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Section: Introductionmentioning

confidence: 99%

Quantitative Performance Comparison of Thermal Structure Function Computations

2021

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“…More specifically, Joint Electron Device Engineering Council (JEDEC) metrics [9] are evaluated and included in the product datasheets. In order to satisfy the request for JEDEC thermal metrics of chosen package families, the authors developed the Thermal Resistance Advanced Calculator (TRAC) tool, the features of which were initially sketched in [10] • providing an exhaustive picture of the TRIC features; • reporting and discussing a larger number of results, including those obtained for the newly included package families (eQFN-mr and PowerSSO); • adding a detailed comparison (only touched upon in [24]) in terms of accuracy and CPU time with the commercial finite-volume (FV) software FloTHERM [25];…”

Section: Introductionmentioning

confidence: 99%

TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages

et al. 2020

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This paper presents the Thermal Resistance and Impedance Calculator (TRIC) tool devised for the automatic extraction of thermal metrics of package families of electronic components in both static and transient conditions. TRIC relies on a solution algorithm based on a novel projection-based approach, which—unlike previous techniques—allows (i) dealing with parametric detailed thermal models (pDTMs) of package families that exhibit generic non-Manhattan variations of geometries and meshes, and (ii) transforming such pDTMs into compact thermal models that can be solved in short times. Thermal models of several package families are available, and dies with multiple active areas can be handled. It is shown that transient thermal responses of chosen packages can be obtained in a CPU (central processing unit) time much shorter than that required by a widely used software relying on the finite-volume method without sacrificing accuracy.

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Three-Steps Approach to Uncertainty Quantification for Electronic Components and Packages

Codecasa

d’Alessandro

2019

2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Thermal Resistance and Impedance Calculator (TRIC)

Cited by 6 publications

References 46 publications

Quantitative Performance Comparison of Thermal Structure Function Computations

Quantitative Performance Comparison of Thermal Structure Function Computations

TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages

Three-Steps Approach to Uncertainty Quantification for Electronic Components and Packages

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