2003
DOI: 10.1016/s0038-1101(03)00216-8
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Thermal resistance variation of HBT with high junction temperature and bias condition

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“…The mechanisms can be concluded as follows: systematically the van der Waals interaction at the interfaces [18] , the surface imperfection [19] and phonon scattering [20] , and the phonon attenuation due to the phonon scatterings [21][22][23] . The main factors that govern the interfacial heat transport across the solid-liquid interface are the bonding strength [24] , temperatures [25][26][27] , and surface size [28][29][30] .…”
Section: Introductionmentioning
confidence: 99%
“…The mechanisms can be concluded as follows: systematically the van der Waals interaction at the interfaces [18] , the surface imperfection [19] and phonon scattering [20] , and the phonon attenuation due to the phonon scatterings [21][22][23] . The main factors that govern the interfacial heat transport across the solid-liquid interface are the bonding strength [24] , temperatures [25][26][27] , and surface size [28][29][30] .…”
Section: Introductionmentioning
confidence: 99%