Thermal response of two-layer systems:

Absi, Joseph; Smith, David Stanley; Naït-Ali, Benoît; Grandjean, Sylvie; Berjonnaux, J.

doi:10.1016/j.jeurceramsoc.2004.02.005

Cited by 8 publications

(5 citation statements)

References 10 publications

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“…It implies that the experimentally measured temperature using the thin-film method generally underpredicts the liquid temperature. Modeling the thin film in a parallel plate limit as a two-layer composite geometry, the estimated time constant of the film to a step change in temperature at the microchannel is 112 ms . Therefore, one can estimate the thermal time response of the thin film to be on the order of a few seconds (2−4 s).…”

Section: Resultsmentioning

confidence: 99%

Method for Microfluidic Whole-Chip Temperature Measurement Using Thin-Film Poly(dimethylsiloxane)/Rhodamine B

2007

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A novel method is presented for on-chip temperature measurements using a poly(dimethylsiloxane) (PDMS) thin film dissolved with Rhodamine B dye. This thin film is sandwiched between two glass substrates (one of which is 150 microm thick) and bonded to a microchannel molded in a PDMS substrate. Whole-chip (liquid and substrate) temperature measurements can be obtained via fluorescent intensity visualization. For verification purposes, the thin film was tested with a tapered microchannel subjected to Joule heating, with resulting axial temperature gradients comparing well with numerical simulations. Errors induced by the definite film thickness are discussed and accounted for during experimental and analytical analysis. Alternative validation using the traditional in-channel Rhodamine B injection method was also attempted. The thin film has several advantages over traditional methods. First, false intensity readings due to adsorption and absorption of Rhodamine B into PDMS channels are eliminated. Second, whole-chip temperature measurements are possible. Third, separation of working liquid from Rhodamine B dye prevents possible electrophoresis effects.

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Section: Resultsmentioning

confidence: 99%

Method for Microfluidic Whole-Chip Temperature Measurement Using Thin-Film Poly(dimethylsiloxane)/Rhodamine B

2007

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“…High thermal contact resistance values are associated to a discontinuous interface and a poor quality of the joint; if the thermal contact resistance is low, the joined component can dissipate a significant quantity of heat for a given thermal gradient, thus confirming a good quality of the joint interface [5][6][7]. This paper reports on the measurement of thermal conductivity and thermal diffusivity of joined C/C-Cu samples by using the laser flash method, one of the most widely used techniques to measure thermo-physical properties of materials.…”

Section: Introductionmentioning

confidence: 99%

Measurement of thermal properties of a ceramic/metal joint by laser flash method

Casalegno

Vavassori²,

Valle³

et al. 2010

Journal of Nuclear Materials

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“…In these applications, the contact between the layers has been seamless. (Cooper et al, 1969;Casalegno et al, 2010;Absi, Smith, Naı̈t-Ali, Grandjean, & Berjonnaux, 2005) This technique can also be used to measure the thermal diffusivities of various materials, including solids, pastes and melts.…”

Section: Public Interest Statementmentioning

confidence: 99%

The thermal contact resistance of a steel-ceramic interface with oxide intermediates

2020

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Metal structures covered by refractories are widely employed in high temperature processes such as incineration and metal production. The thermal resistance in refractories used in high temperature processes is associated with different phases, phase boundaries and porosity in the refractory and with the thermal contact resistance between the refractory and the metal interface. Here, a light flash method was used to evaluate the thermal contact resistance of the ceramic/steel interface at temperatures of 25, 100, 200, 300 and 400°C. The material combinations studied were a commonly-used reference ceramic, Pyroceram 9606, and pressure vessel steel with oxidizing treatment at 450 and 650°C for 50 h. Thermal resistance at a ceramic/steel interface increased significantly when a porous oxide layer was formed on the steel surface. The thermal contact resistance of the interface varied from 0.1 to 0.4 × 10 −3 m 2 K/W, depending on the temperature and the oxidization of the steel sample.

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Thermal response of two-layer systems:

Cited by 8 publications

References 10 publications

Method for Microfluidic Whole-Chip Temperature Measurement Using Thin-Film Poly(dimethylsiloxane)/Rhodamine B

Method for Microfluidic Whole-Chip Temperature Measurement Using Thin-Film Poly(dimethylsiloxane)/Rhodamine B

Measurement of thermal properties of a ceramic/metal joint by laser flash method

The thermal contact resistance of a steel-ceramic interface with oxide intermediates

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