Thermal Runaway Mitigation through Electrothermal Constraints Mapping for MCPM Layout Optimization

Influence of the rds,on temperature dependency of SiC MOSFETs on the optimal switching cell mechanical layout

“…Concerning multi-objective optimisation procedures for the mechanical design, the focus has mainly been on optimising the geometry of single components as magnetics [10], or capacitors [8], or of the cooling system for dissipating losses [12]. More recent studies propose also mechanical design optimisation of the switching module [13,14] and its control scheme [15], or the unified switching cell (SC) block (i.e. power semiconductor devices, gate drivers, decoupling capacitors, and cooling system) as an individual building block [16].…”

“…In [13,14] a multi-objective optimisation tool for the rapid design of power semiconductor modules is presented for optimising the module's layout in terms of performance and power density. This tool includes models of the electrical parasitics and the thermal coupling between the devices.…”