Thermal Sensors

doi:10.1007/978-1-4939-2581-0

Cited by 14 publications

(1 citation statement)

References 61 publications

(136 reference statements)

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“…Due to its importance in thermal control, a significant effort has been expended in several other engineering systems to measure the core temperature. For example, in computer microprocessors, temperature sensors are embedded deep within the microprocessor chip where the highest temperature is expected to be encountered [26]. Similar core temperature measurement is also desirable for Li-ion cells.…”

Section: Introductionmentioning

confidence: 99%

Non-invasive measurement of internal temperature of a cylindrical Li-ion cell during high-rate discharge

Anthony

Wong

Wetz

et al. 2017

International Journal of Heat and Mass Transfer

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Li-ion cells are a technologically important class of devices for electrochemical energy storage and conversion. Overheating of a Li-ion cell during operation is undesirable as it directly affects performance and safety. Although a number of methods have been used for temperature measurement in Li-ion cells, there is a lack of non-invasive techniques to determine the peak temperature at the core of the cell. Measuring only the outside surface temperature, while straightforward, is not sufficient since the core temperature is in most cases much higher. This paper presents non-invasive measurement of the core temperature of a Li-ion cell using a recently developed technique that utilizes space and time integrals of the measured temperature field at the outside surface. The surface temperature field of an operating Li-ion cell is measured using infrared thermography at multiple discharge rates up to 10C, using which, the core temperature is predicted as a function of time. In each case, there is excellent agreement throughout the discharge period between the predicted core temperature and measurements from a thermocouple embedded at the core of the cell. These measurements quantify the temperature gradient within the cell, which is particularly high at large discharge rates. This paper may result © 2016. This manuscript version is made available under the Elsevier user license http://www.elsevier.com/open-access/userlicense/1.0/ 2 in non-invasive core measurement methods that may contribute towards performance optimization and improved safety of Li-ion cells.

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Section: Introductionmentioning

confidence: 99%

Non-invasive measurement of internal temperature of a cylindrical Li-ion cell during high-rate discharge

Anthony

Wong

Wetz

et al. 2017

International Journal of Heat and Mass Transfer

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Power and thermal modeling approach for homogeneously stacked butterfly fat tree architecture in 3D ICs

Durrani

2018

Int J Numerical Modelling

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Low‐power consumption and heat dissipation are becoming serious issues in the design process of the 3D integrated circuit (IC). The multiple dies are stacked and communicated through‐silicon vias to work as a single device to achieve high performance with minimum power and heat dissipation. This paper presents the power and thermal modeling approaches for the power/heat estimation of homogenous integration of network‐on‐chip‐based tree architecture in 3D IC design. The preliminary experimental work of power model is divided in 2 major parts of the design. The first part estimates the power of network‐on‐chip tree architecture on each stack/layer separately, and the second estimates the power dissipation of the uniformly distributed through‐silicon vias and input/output pads. The model uses a linear function to estimate the average power dissipation. The thermal model estimates the heat dissipation by using thermal sensors on different sections of the individual layer. For an entire IC design, the average power/thermal is extracted by simple addition of all power/thermal estimation results of the model. The design is operated with multiple frequencies to find the most appropriate frequency to minimize power dissipation. In experiments, the average maximum error is estimated 16.29%.

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