Thermal simulation analysis of high power LED system using two-resistor compact LED model

Ong, Zeng Yin; Shanmugan, S.; Devarajan, Mutharasu

doi:10.1109/asqed.2013.6643609

Cited by 5 publications

(3 citation statements)

References 6 publications

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“…Thermal management design criteria for LED arrays have been established [14]. In addition to experimentation, heat transfer in single-sided MCPCBs has been simulated using CFD packages [15]. However, most if not all of the current research uses a single-sided MCPCB stack-up similar to that shown in Figure 1a, a style which is limited to surface mount components only.…”

Section: Introduction and Overview Of The Research And Results Of Sysmentioning

confidence: 99%

Thermal Performance of Double-Sided Metal Core PCBs

et al. 2019

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Thermal management in printed circuit boards is becoming increasingly more important as the use of LEDs is now widespread across all industries. Due to availability of the preferred electronic LED current drivers and system constraints for a machine-vision application, the design dictated the need for a double-sided metal core printed circuit board (MCPCB). However, design information for this relatively new MCPCB offering is sparse to non-existent. To fill-in this missing information in the literature, experiments were conducted where LEDs were arranged on a double-sided metal core printed circuit board (MCPCB), and their impact on the board temperature distribution was tested in a static fan-less configuration where the first condition was at room temperature, 23 °C, and the second configuration was for a heated environment, 40 °C. Two MCPCB orientations were tested (vertical and horizontal). Additionally, several LED arrangements on the MCPCB were configured, and temperatures were measured using a thermocouple as well as with a deep-infrared thermal imaging camera. Maximum temperatures were found to be 65.3 °C for the room temperature tests and 96.4 °C for the heated tests with high temperatures found in near proximity to the heat sources (LEDs), indicating less than ideal heat-conduction/dissipation by the MCPCB. The results indicate that the double-sided MCPCB topology is not efficient for high thermally loaded systems, especially when the target is a fan-less system. The results of testing indicate that for fan-less systems requiring high-performance heat-transfer, these new MCPCB are not a suitable design alternative, and instead, designers should stick with the more traditional single-sided metal-back PCB.

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Section: Introduction and Overview Of The Research And Results Of Sysmentioning

confidence: 99%

Thermal Performance of Double-Sided Metal Core PCBs

et al. 2019

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“…Thermal step response functions are highly characteristic that the changes in temperature occur in an extreme wide range of time (Szkely et al , 1999). A few microseconds are needed to raise temperature after excitation, but hundreds or thousands of seconds are required to reach steady state (Ong et al , 2013; Mah et al , 2015). Structure functions, which are thermal resistance and capacitance map of a heat-flow path, are used to determine material transitions within semiconductor device in the heat- flow path (Teeba et al , 2011).…”

Section: Theoretical Backgroundmentioning

confidence: 99%

Variation of thermal resistance with input current and ambient temperature in low-power SMD LED

Raypah

Dheepan

Devarajan

et al. 2018

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Purpose Thermal behavior of light-emitting diode (LED) device under different operating conditions must be known to enhance its reliability and efficiency in various applications. The purpose of this study is to report the influence of input current and ambient temperature on thermal resistance of InGaAlP low-power surface-mount device (SMD) LED. Design/methodology/approach Thermal parameters of the LED were measured using thermal transient measurement via Thermal Transient Tester (T3Ster). The experimental results were validated using computational fluid dynamics (CFD) software. Findings As input current increases from 50 to 90 mA at 25°C, the relative increase in LED package (ΔRthJS) and total thermal resistance (ΔRthJA) is about 10 and 4 per cent, respectively. In addition, at 50 mA and ambient temperature from 25 to 65°C, the ΔRthJS and ΔRthJA are roughly 28 and 22 per cent, respectively. A good agreement between simulation and experiment results of junction temperature. Originality/value Most of previous studies have focused on thermal management of high-power LEDs. There were no studies on thermal analysis of low-power SMD LED so far. This work will help in predicting the thermal performance of low-power LEDs in solid-state lighting applications.

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“…Simulation results also show that heat generation is increased with this high thermal resistance. [5]. During thermal system design, there are some criteria.…”

Section: Fig 3 Buck Circuit Based Led Drivermentioning

confidence: 99%

Thermal management of power LED system

Akça

Yaşa

Ayaz

et al. 2014

2014 International Conference on Renewable Energy Research and Application (ICRERA)

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LEDs are used in many areas today. Street lighting is one of them and high-power LEDs are utilized in this area. Electrical energy is converted into light with an efficiency in 10-25% range. The rest is converted into heat. The generated heat is largely caused from LED chip. Furthermore, Driver circuit would also causes heat rise. Removing of this heat from the system is important in order to LED system efficiency because increasing of temperature causes a reduction of luminous flux. Excellent thermal management plays a significant role in terms of efficiency, reliability and durability. In this study, losses are caused from the LED chip and the heat sink which are part of the LED lighting systems are examined. These elements are thermally analyzed. The impacts of these losses on efficiency will be presented.

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Thermal simulation analysis of high power LED system using two-resistor compact LED model

Cited by 5 publications

References 6 publications

Thermal Performance of Double-Sided Metal Core PCBs

Thermal Performance of Double-Sided Metal Core PCBs

Variation of thermal resistance with input current and ambient temperature in low-power SMD LED

Thermal management of power LED system

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