2015 International 3D Systems Integration Conference (3DIC) 2015
DOI: 10.1109/3dic.2015.7334616
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Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks

T. Robert Harris
1
,
Eric J. Wyers
2
,
Lee Wang
3
et al.
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Cited by 5 publications
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Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages

Harris
1
,
Davis
2
,
Lipa
3
et al. 2019
2019 International 3D Systems Integration Conference (3DIC)
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0
1
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Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages

Harris
1
,
Davis
2
,
Lipa
3
et al. 2019
2019 International 3D Systems Integration Conference (3DIC)
1
0
1
0
View full textAdd to dashboardCite

Static thermal simulation of Heterogeneous InP-Slicon 3D IC Stack

Yang
1
,
Zhang
2
,
Yang3
et al. 2019
2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
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Steady-State Thermal Simulation of the InP HBT Device Heat Spreading in DAHI Chip

Wang
1
,
Zhang
2
,
Li
3
et al. 2019
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)
1
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