Thermal stability analysis of passive components embedded into printed circuit boards

Abstract

Purpose The purpose of this paper is to investigate the behavior of embedded passives under changing temperature conditions. Influence of different temperature changes on the basic properties of embedded passives was analyzed. The main reason for these investigations was to determine functionality of passives for space application. Design/methodology/approach The investigations were based on the thin-film resistors made of Ni-P alloy, thick-film resistors made of carbon or carbon-silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. Prepared samples were examined under the influence of a constant elevated temperature (100, 130 or 160°C) in a long period of time (minimum of 30 h), thermal cycles (from −40 to +85°C) or thermal shocks (from −40 to +105°C or from −40 to +125°C). Findings The achieved results revealed that resistance drift became bigger when the samples were treated at a higher constant temperature. At the same time, no significant difference in change in electrical properties for 50 and 100 Ω resistors was noticed. For all the tests, resistance change was below 2 per cent regardless of a value of the tested resistors. Conducted thermal shock studies indicate that thin-film resistors, coils and some thick-film resistors are characterized by minor variations in basic parameters. Some of the inks may show considerable resistance variations with temperature changes. Significant changes were also exhibited by embedded capacitors. Originality/value The knowledge about the behavior of the operating parameters of embedded components considering environmental conditions allow for development of more complex systems with integrated printed circuit boards.

Assessment of stability and reliability of embedded components in printed circuit boards

“…Results of investigation presented in this article are a part of the wide investigation of passives embedded in PCB. Other results, for example connected with long-term stability and reliability, were presented by Stęplewski et al (2014, 2012a, 2012b) and Winiarski et al (2012).…”

“…The polymer thick-film resistors were made in a standard thick-film method (Stęplewski et al , 2012a, 2012b; Serzysko et al , 2011). For their manufacturing, the inks with a sheet resistance of 200 Ω/sq./25 μm (ED7100_200 Ω – carbon ink) and 20 Ω/sq./25 μm (ED7500_20 Ω – carbon–silver ink) from Electra Polymers Ltd., and 10 Ω/sq./25 μm (MINICO M2010 RS MOD2 – carbon ink) and 1,000 Ω/sq./25 μm (MINICO M2013 RS MOD2 – carbon ink) from Acheson were used.…”