2011
DOI: 10.1149/2.056111jes
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Thermal Stability and Performance of NbSiTaTiZr High-Entropy Alloy Barrier for Copper Metallization

Abstract: Development of better diffusion barriers for Cu metallization is one of the key issues for the microelectronics industry. Although metallic diffusion barriers offer many advantages, their application is hindered due to their inferior thermal stability relative to ceramic barriers. Here we report on a metallic diffusion barrier, NbSiTaTiZr, which shows thermal stability comparable to ceramic barriers. The outstanding performance of NbSiTaTiZr is due to its better structural and chemical stability at high temper… Show more

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Cited by 188 publications
(57 citation statements)
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“…[34,82] Another example is the NbSiTaTiZr amorphous alloy. The crystallization temperature of NbSiTaTiZr is higher than 800 • C. [23] This temperature of stability is probably the highest among reported amorphous metals. The excellent structural stability comes not just from the above two reasons.…”
Section: High Temperatures Properties and Structuralmentioning
confidence: 97%
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“…[34,82] Another example is the NbSiTaTiZr amorphous alloy. The crystallization temperature of NbSiTaTiZr is higher than 800 • C. [23] This temperature of stability is probably the highest among reported amorphous metals. The excellent structural stability comes not just from the above two reasons.…”
Section: High Temperatures Properties and Structuralmentioning
confidence: 97%
“…[2,20,21] It also contributes to the excellent performance of HEA coatings as diffusion barriers. [22,23] Moreover, it allows better high-temperature strength and structural stability, which are discussed in Section 5. For the same reason, HEAs are also expected to have outstanding creep resistance.…”
Section: Sluggish Diffusion Effectmentioning
confidence: 99%
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