2019
DOI: 10.1016/j.cej.2019.05.179
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Thermal stability of Ag9GaSe6 and its potential as a functionally graded thermoelectric material

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Cited by 44 publications
(47 citation statements)
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“…The key challenge for enhancing the performance of TE materials is establishing a balance between their property indicators in the equation describing their dimensionless figure of merit ( zT ) value (Equation (1)): [ 1,2 ] zT=S2 σκ1T where S , σ, κ , and T are the Seebeck coefficient, electrical conductivity, total thermal conductivity, and absolute temperature, respectively. The total thermal conductivity comprises the contributions [ 3 ] the from lattice vibrations (κ l ) and charger carriers (κ e ) and can be expressed by κ = κ l + κ e . High zT values require a high power factor ( S 2 σ, PF) and a low total thermal conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…The key challenge for enhancing the performance of TE materials is establishing a balance between their property indicators in the equation describing their dimensionless figure of merit ( zT ) value (Equation (1)): [ 1,2 ] zT=S2 σκ1T where S , σ, κ , and T are the Seebeck coefficient, electrical conductivity, total thermal conductivity, and absolute temperature, respectively. The total thermal conductivity comprises the contributions [ 3 ] the from lattice vibrations (κ l ) and charger carriers (κ e ) and can be expressed by κ = κ l + κ e . High zT values require a high power factor ( S 2 σ, PF) and a low total thermal conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…The first compound of the argyrodite family, for which thermoelectric properties were presented, is Cu 7 PSe 6 [16]. This led to the fact that the greatest amount of information concerns the study of selenium-containing compounds with the argyrodite structure: Cu 8 GeSe 6 and Ag 8 GeSe 6 [17,18], Ag 9 GaSe 6 [19], Cu 7 PSe 6 [20,21]. However, the investigations of S −2 ↔ Se −2 [22] [17].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the heat flux in modern systems has passed the threshold of 500 W/cm 2 ; therefore, air‐based heat sinks are not adequate for removing the thermal load again 2 . In contrast, the recent development of functionally graded materials could effectively help in removing hotspots in high heat flux devices; however, its adoption has been limited due to its astronomical cost 3‐5 . In the last couple of decades, the use of liquid cooling has gained considerable attention 6‐9 .…”
Section: Introductionmentioning
confidence: 99%
“…2 In contrast, the recent development of functionally graded materials could effectively help in removing hotspots in high heat flux devices; however, its adoption has been limited due to its astronomical cost. [3][4][5] In the last couple of decades, the use of liquid cooling has gained considerable attention. [6][7][8][9] Similarly, the recent emergence of other cooling technologies, such as microchannel heat sink (MCHS), 10 improved heat transfer fluid (nanofluids), 11 and flow boiling heat transfer 12 has exhibited substantial impressions on a separate basis.…”
Section: Introductionmentioning
confidence: 99%