2010
DOI: 10.1016/j.apsusc.2010.07.107
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Thermal stability of alumina thin films containing γ-Al2O3 phase prepared by reactive magnetron sputtering

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Cited by 121 publications
(38 citation statements)
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“…In order to obtain γ-Al2O3 without amorphous phase, by means of reactively pulsed DC sputtering, a substrate temperature of at least 500 °C was needed as well as high power densities (with floating bias voltage) [29]. Similar deposition temperatures for reactive pulsed DC processes has been reported by several authors [16,17,30,31]. With RF-sputtering it has been obtained at 450 °C -500 °C [32,33].…”
mentioning
confidence: 77%
“…In order to obtain γ-Al2O3 without amorphous phase, by means of reactively pulsed DC sputtering, a substrate temperature of at least 500 °C was needed as well as high power densities (with floating bias voltage) [29]. Similar deposition temperatures for reactive pulsed DC processes has been reported by several authors [16,17,30,31]. With RF-sputtering it has been obtained at 450 °C -500 °C [32,33].…”
mentioning
confidence: 77%
“…This work was followed by Yamada et al who reported on the reactive deposition of α-Al 2 O 3 from a filtered vacuum arc at 780 ∘ C [14]. The lowest temperature for the deposition of α-alumina in the literature is 280 ∘ C [15] and the maximum deposition rate reported was 150 nm/h [11]. The process of reactive sputter deposition involves (1) the sputtering process (2) the physics of the plasma discharge (3) transport of the sputtered and gas species (4) the kinetics of film growth (5) and the chemical interactions at the target and film surfaces.…”
Section: Introductionmentioning
confidence: 97%
“…Since the alumina has high thermal conductivity among them, 8) the functional materials will be thermally stabilized with their incorporation into the alumina films.…”
Section: )7)mentioning
confidence: 99%