Thermal stability of Cu@Ag core–shell nanoparticles

Tsai, Chi Hang; Chen, Shih Yun; Song, Jenn‐Ming; Chen, In‐Gann; Lee, Hsin Yi

doi:10.1016/j.corsci.2013.04.032

Cited by 102 publications

(59 citation statements)

References 29 publications

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“…The spectra of the samples are similar to the spectrum of Cu-Ag nanoparticles reported by Tsail et al [9]. The spectra of the samples with L = 0.6 and 0.8 exhibit only one peak at the absorption region of Ag nanoparticles (~420-432 nm), suggesting the absence of Cu nanoparticles in the samples.…”

Section: Fig 4 Tem Images and Particle Size Distributions Of The Samsupporting

confidence: 83%

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Synthesis of Core-Shell Nanoparticles of Cu-Ag for Application in Electrohydrodynamic Printing Technique

Trinh¹,

Đặng²,

Dang³

2019

JMSE-A

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Core-shell nanoparticles of Cu-Ag (Cu core and Ag shell) were synthesized using chemical method. Polyvinyl pyrrolidone (PVP) was used as a surfactant, and ascorbic acid (C 6 H 8 O 6) and sodium borohydride (NaBH 4) were used as reducing agents to reduce the metal complexes [Cu(NH 3) 4 ] 2+ and [Ag(NH 3) 2 ] +. The results of transmission electron microscope (TEM) analysis, ultraviolet-visible spectroscopic (UV-Vis) analysis, X-ray diffraction (XRD) analysis showed that the core-shell nanoparticles of Cu-Ag were successfully synthersized. The average particle size was 32 nm. The dispersion of the nanoparticles was still good after 80 days without the formation of the oxides of Cu and Ag. The properties of the nanoparticles suggested that they were suitable to be used as an electrically conductive material for conductive ink-jet printing inks.

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Section: Fig 4 Tem Images and Particle Size Distributions Of The Samsupporting

confidence: 83%

“…3 shows the UV-Vis spectra of the samples synthesized with different ratio of Ag + /Cu 2+ . Inset is the spectrum of Cu-Ag nanoparticles reported by Tsail et al [9]. As seen in Fig.…”

Section: Effects Of Ag + /Cu 2+ Ratio On the Formation Of Cu-ag Core-mentioning

confidence: 99%

Synthesis of Core-Shell Nanoparticles of Cu-Ag for Application in Electrohydrodynamic Printing Technique

Trinh¹,

Đặng²,

Dang³

2019

JMSE-A

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“…Alternatively, coating Cu particle with Ag by chemical processes seems to represent a prospective way of promoting oxidation resistance without sacrificing the electrical conductivity131415. However, such enhancement turns out not to be striking due to the low adhesive force at the Cu-core/Ag-shell interface and also for the loose microstructures of Ag shells on Cu particles1617 that are unable to obstruct the inward diffusion of O. For electrical transferring Cu powder, these two essential properties, high electrical conductivity and high oxidation resistance, seems always contradictory.…”

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confidence: 99%

Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder

Wang

et al. 2016

Sci Rep

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The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powder with both a high electrical conductivity and a high oxidation resistance represents one of the key challenges in developing next-generation electrical transferring powder. Here, we fabricate a Cu-Ag powder with a continuous Ag network along grain boundaries of Cu particles and demonstrate that this new structure can inhibit the preferential oxidation in grain boundaries at elevated temperatures. As a result, the Cu-Ag powder displays considerably high electrical conductivity and high oxidation resistance up to approximately 300 °C, which are markedly higher than that of pure Cu powder. This study paves a new pathway for developing novel Cu powders with much enhanced electrical conductivity and oxidation resistance in service.

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“…The major problem in the synthesis of Cu-Ag heterostructures is their high lattice mismatch (the lattice constant values of Cu and Ag are 0.409 nm and 0.361 nm respectively) which results in high interfacial energy [7]. Reports suggest that in bimetallic Cu-Ag nanostructures, mixing of copper with silver will significantly enhance the migration of copper ions [8,9]. Methods for the synthesis of Cu-Ag alloyed nanoparticles include wet chemical reduction, micro emulsion, sonochemical methods, and microwave methods [10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

A facile synthesis of Cu–CuO–Ag nanocomposite and their hydrogenation reduction of p-nitrophenol

2020

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In this study, a nanocatalyst of Cu-CuO-Ag was synthesized by a facile chemical reduction method. By varying the amount of metallic precursor, different compositions of the Cu-CuO-Ag nanocomposite were synthesized, and their structural and morphological characterizations were carried out. The nanocomposites were used for the hydrogenation reduction of p-nitrophenol to p-aminophenol using sodium borohydride as the reducing agent. The catalytic activity of Cu-CuO-Ag nanocomposite had a catalytic activity that was 4.5 fold higher than that of Cu-CuO nanocomposite. The kinetic studies revealed pseudo-first order kinetics and the reduction reaction completed within four minutes. The maximum rate constant value of 0.565 min −1 was obtained for the composite prepared with a copper precursor to silver precursor ratio of 16:1. The developed Cu-CuO-Ag nanocomposite also showed excellent catalytic stability. There was no noticeable decrease in catalytic activity even after four cycles. Furthermore, we optimized the catalyst amount required for the reduction reaction.

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Thermal stability of Cu@Ag core–shell nanoparticles

Cited by 102 publications

References 29 publications

Synthesis of Core-Shell Nanoparticles of Cu-Ag for Application in Electrohydrodynamic Printing Technique

Synthesis of Core-Shell Nanoparticles of Cu-Ag for Application in Electrohydrodynamic Printing Technique

Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder

A facile synthesis of Cu–CuO–Ag nanocomposite and their hydrogenation reduction of p-nitrophenol

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