2015
DOI: 10.1016/j.phpro.2015.09.078
|View full text |Cite
|
Sign up to set email alerts
|

Thermal Stability of Ge/GeSn Nanostructures Grown by MBE on (001) Si/Ge Virtual Wafers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
4
0

Year Published

2019
2019
2023
2023

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 9 publications
(4 citation statements)
references
References 10 publications
0
4
0
Order By: Relevance
“…Growth of GeSn on Ge is difficult due to low solubility (<1%) of Sn in Ge and the instability of α-Sn above 13 °C. In order to grow GeSn material, growth techniques were developed under non-equilibrium growth conditions such as low temperature growth via either MBE [10][11][12][13][14][15][16] , or CVD [17][18][19][20][21][22][23][24] . The CVD growth of GeSn has been investigated over a decade.…”
Section: Introductionmentioning
confidence: 99%
“…Growth of GeSn on Ge is difficult due to low solubility (<1%) of Sn in Ge and the instability of α-Sn above 13 °C. In order to grow GeSn material, growth techniques were developed under non-equilibrium growth conditions such as low temperature growth via either MBE [10][11][12][13][14][15][16] , or CVD [17][18][19][20][21][22][23][24] . The CVD growth of GeSn has been investigated over a decade.…”
Section: Introductionmentioning
confidence: 99%
“…For practical applications in optoelectronic and electric devices, the thermal stability of Ge 1−x Sn x material is a crucial property which has been widely studied and reported [17,23,24,[41][42][43][44][45]. Zaumseil et al showed that the tin segregation temperature of Ge 1−x Sn x alloys increases with decreasing Sn content, and that Ge 0.91 Sn 0.09 was stable at temperatures up to 400°C [17].…”
Section: Resultsmentioning
confidence: 99%
“…Germanium is used as the p + source, since it exhibits a lower bandgap as compared to Silicon, and since Germanium is a potential candidate for digital applications that produce high electron and hole density, resulting in enhanced drive current [40]. In addition, the Germanium device is less immune to thermal cracking even at high temperatures indicating that Ge is a low thermal stability material [41]. The channel region and the n + drain region employ Silicon to retain a low leakage current.…”
Section: Device Structure and Simulation Methodologymentioning
confidence: 99%