“…In contrast, significant grain growth from 150 nm to 1-3 lm was observed by both Č ížek et al [20] and Jiang et al [21] during annealing ultrafine structured Cu at 500°C for 1 h. Similarly, Zhilyaev et al [22] reported that after 1 h annealing at 500°C an ultrafine grained Ni sample made by ECAP completely lost its ultrafine structure and the average grain size reached 33 lm. This demonstrate that Al 2 O 3 nanoparticles significantly retard the coarsening of ultrafine Cu grains, in agreement with the observation made in previous studies [13,[23][24][25][26].…”