Thermal stability of ultrafine-grained metals and alloys

Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples

“…In the literature, most of experiment results showed that the strain release process in nc samples always occurs prior to or simultaneously with the grain growth process, as seen in nc Cu and Ag samples [6]. This until now, the enhanced grain size stability due to a high dislocation density needs more detail investigation.…”

“…Most thermal stability studies in nc metals had been done on the consolidated nc samples, in which there were usually with high degree of microstrain, contamination, flaws and/or porosity, due to the imperfect particulate bonding. The effect of porosity [5], impurity [6] and texture [7] on the thermal stability of nc materials had been demonstrated. The effect of microstrain, however, has not been well understood until now.…”

Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy

“…Onset temperature T on of grain growth and heat release DH for nc Cu-Bi and nc Cu with various grain sizes reported in the literature (Ref 16,17) are summarized in Table 1. Also listed in Table 1 are available values of T on and DH from the published literature for nc Ni ( Ref 18) and Pd ( Ref 16).…”

Hardening and thermal stability of nanocrystalline AlMg4.8 powder

“…When NC materials are investigated, the synthesis process always has to be considered, as each route introduces specific contaminations. Impurities and inhomogeneities can strongly alter the mechanical behaviour and especially the thermal stability [3]. The enhanced resistance to grain growth is associated to compositional parameters as well as to microstructural inhomogeneities as vacancies [4].…”