Thermal stress and fracture in shear-constrained semiconductor device structures

Effects of Silver Dissolved in Eutectic Gold‐Silicon Solder on Silicon Devices

“…The beneficial impact of oxygen precipitation in silicon wafers as a gettering sink for metallic impurities has been studied extensively (1)(2)(3). Huff et al (4) have shown that internal gettering by oxygen precipitation in the bulk of a silicon wafer reduces yield losses due to refresh failures in dynamic memory devices.…”

“…Au plating has also been utilized for the surface coating on the leadframe of plastic-encapsulated packages for semiconductor devices. When the Au-plated leadframe and eutectic Au-Si solder are applied together, the chips become bonded at the eutectic temperature of the solder, that is, about 370~ The stress induced in such bonded chips and the thermal fatigue performance of the die bond system have been studied by many researchers (1)(2)(3)(4). These studies have clearly established that the soldered chips can withstand the necessary power cycling tests without experiencing problems due to thermal fatigue.…”

Thermally induced strain in joints with dissimilar adherends bonded with a flexible adhesive

“…Analytical work on the development of thermal stresses in multimaterial layered structures when subjected to temperature loading has been made by Taylor and Yuan [12] following the theory of Volkersen [13]. In addition, Chen and Nelson [14], Suhir [15][16][17], Jiang et al [18] and more recently Wong et al [19] and He [20] have developed analytical models describing thermal deformations and interfacial stresses caused by CTE mismatch in bonded joints.…”

Universal length dependence of tensile stress in nanomechanical string resonators

“…The reconfiguration of the clamping structure stops once equilibrium between the reduced tensile force and the counteracting shearing force is reached. The shear stress τ of such a shear-constrained material system can be expressed as [40]…”