Encyclopedia of Thermal Stresses 2014
DOI: 10.1007/978-94-007-2739-7_275
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Thermal Stress in MEMS

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Cited by 4 publications
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“…The sensors are glued to the sensor plate to achieve small device sizes. As stated by [18], "the performance of a MEMS device can be strongly affected by thermal stresses resulting from constraining interactions among device's multiple layers and between the package and the device". Referring to the camera design, changes of the camera temperature may have strong impact on the camera geometry stability and thus on the measurement accuracies compared to e.g., DSLR cameras.…”
Section: Introductionmentioning
confidence: 99%
“…The sensors are glued to the sensor plate to achieve small device sizes. As stated by [18], "the performance of a MEMS device can be strongly affected by thermal stresses resulting from constraining interactions among device's multiple layers and between the package and the device". Referring to the camera design, changes of the camera temperature may have strong impact on the camera geometry stability and thus on the measurement accuracies compared to e.g., DSLR cameras.…”
Section: Introductionmentioning
confidence: 99%