1989
DOI: 10.1115/1.3176131
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Thermal Stresses at the Edge of a Bimetallic Thermostat

Abstract: The plane stress problem of a semi-infinite, bimetallic thermostat subjected to uniform heating or cooling is treated with the theory of elasticity. Solutions to this problem are expressed as the sum of a basic solution for a bimetallic strip of infinite length and a series of complementary solutions. Interlayer peeling stresses at the free edge of the bimetallic thermostat are shown to be singular or nonsingular (but still higher than the nominal values) depending upon whether the combination of the two Dundu… Show more

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Cited by 93 publications
(33 citation statements)
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“…Kuo [10] obtained an exact solution for an infinitely long bimetallic strip under similar conditions. Kuo's problem is not unlike the problem being considered here.…”
Section: Crackless Bimaterials Stripmentioning
confidence: 97%
“…Kuo [10] obtained an exact solution for an infinitely long bimetallic strip under similar conditions. Kuo's problem is not unlike the problem being considered here.…”
Section: Crackless Bimaterials Stripmentioning
confidence: 97%
“…The smaller the element size, the higher the resulting strains. This finite element mesh size dependency is primarily due to the stress/strain singularity at the edge of a bimaterial (Kuo, 1990: Kuo et al, 1997Yin, 1992Yin, , 1993. Therefore, to minimize the mesh dependence problem, a volume-weighted average method (Kuo et al, 1997) is used to compute an average effective strain over all the elements in the critical layer:…”
Section: Figure 21 Flowchart For Evaluating Bga Solder Joint (Or Intementioning
confidence: 99%
“…These assemblies are typically manufactured at an elevated (curing) temperature and are subsequently cooled down to a low (room, operating, testing) temperature. Because of the dissimilar materials, such assemblies experience, at low temperature conditions, thermally induced stresses and deformations that change with the change in temperature (Timoshenko, 1925;Aleck, 1949;Pan und Pao, 1990;Kuo, 1990;Suhir, 1991;2000b;Lau, 1993).…”
Section: Introductionmentioning
confidence: 98%