“…These assemblies are typically manufactured at an elevated (curing) temperature and are subsequently cooled down to a low (room, operating, testing) temperature. Because of the dissimilar materials, such assemblies experience, at low temperature conditions, thermally induced stresses and deformations that change with the change in temperature (Timoshenko, 1925;Aleck, 1949;Pan und Pao, 1990;Kuo, 1990;Suhir, 1991;2000b;Lau, 1993).…”