Thermal Transfer-Enabled Rapid Printing of Liquid Metal Circuits on Multiple Substrates

Guo, Rui; Li, Tianyu; Wu, Ziyue; Wan, Chunxue; Niu, Jing; Huo, Wenxing; Yu, Haixia; Huang, Xian

doi:10.1021/acsami.2c08743

Cited by 28 publications

(13 citation statements)

References 44 publications

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“…124 The formulations and the various processes used to obtain soft electronics by the 2D transfer approach are summarized in Table 3. Guo et al 125 (Figure 3A) reported on a liquid metal ink consisting of 18 wt % silver-coated copper microparticles embedded in NaOH-treated gallium-indium eutectic alloys (EGaIn). The incorporated silver-coated copper microparticles act as a rheology modifier, preventing the shaggy of printed EGaIn during print.…”

Section: D Transfer Approachmentioning

confidence: 99%

Fabrication Approaches of Soft Electronics

Tan

Farraj

Kamyshny

et al. 2023

ACS Appl. Electron. Mater.

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The use of conductive materials to be printed/embedded onto/within a polymeric matrix has gained increasing attention in the fabrication of next-generation soft electronics. In this review, we provide a comprehensive overview of the materials and approaches for the fabrication of 2D and 3D conductive structures while focusing on the importance of the compatibility between the particles' shape, the polymeric matrix type, and the deposition method, along with the target application. The review presents a summary of the main conductive materials and the type of polymeric materials which were utilized for fabricating soft electronic devices that are bendable/twistable and stretchable. It is divided into two sections: Introduction section, which presents briefly conductive materials, polymeric matrix, and fabrication methods, and Fabrication section, presenting the main 6 approaches of fabrication. Each of the fabrication subsections presents the main recent reports in a detailed table. The review is concluded with an Outlook section, describing the current challenges in this field. Despite the progress in the fabrication of 2D bendable/twistable electronic devices toward industrial integration, there is still a need for tailoring and improving the durability and robustness of 3D stretchable electronic devices.

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Section: D Transfer Approachmentioning

confidence: 99%

Fabrication Approaches of Soft Electronics

Tan

Farraj

Kamyshny

et al. 2023

ACS Appl. Electron. Mater.

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“…In addition, some studies have found that the specially treated toner has high adhesion to the LM, so the LM can be coated on the toner surface and then transferred to other flexible substrate surfaces (Zhao et al, 2020). In addition to the water transfer method, the toner pattern can also be transferred to a flexible substrate to make a template with selective adhesion to LM at a certain pressure and temperature (Guo et al, 2022). As shown in Figure 7E, first use a laser printer to print the toner pattern on the thermal transfer paper.…”

Section: Transfer Printing Substratementioning

confidence: 99%

“…Copyright@2020, RSC (E) Principle and the fabrication process of the liquid meal conductive traces. (Guo et al, 2022). Copyright@2022, ACS (F) LM patterns on smooth substrate and rough substrate (Guo et al, 2022).…”

Section: Lm-elastomer Compositesmentioning

confidence: 99%

“…(Guo et al, 2022). Copyright@2022, ACS (F) LM patterns on smooth substrate and rough substrate (Guo et al, 2022). Copyright@2022, ACS.…”

Section: Lm-elastomer Compositesmentioning

confidence: 99%

“…The temperature monitoring circuit transferred to human skin(Guo et al, 2020). Copyright@2020, RSC (E) Principle and the fabrication process of the liquid meal conductive traces (Guo et al, 2022)…”

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confidence: 99%

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Liquid metal enabled conformal electronics

Ping

Zhou²,

Zhang³

et al. 2023

Front. Bioeng. Biotechnol.

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The application of three-dimensional common electronics that can be directly pasted on arbitrary surfaces in the fields of human health monitoring, intelligent robots and wearable electronic devices has aroused people’s interest, especially in achieving stable adhesion of electronic devices on biological dynamic three-dimensional interfaces and high-quality signal acquisition. In recent years, liquid metal (LM) materials have been widely used in the manufacture of flexible sensors and wearable electronic devices because of their excellent tensile properties and electrical conductivity at room temperature. In addition, LM has good biocompatibility and can be used in a variety of biomedical applications. Here, the recent development of LM flexible electronic printing methods for the fabrication of three-dimensional conformal electronic devices on the surface of human tissue is discussed. These printing methods attach LM to the deformable substrate in the form of bulk or micro-nano particles, so that electronic devices can adapt to the deformation of human tissue and other three-dimensional surfaces, and maintain stable electrical properties. Representative examples of applications such as self-healing devices, degradable devices, flexible hybrid electronic devices, variable stiffness devices and multi-layer large area circuits are reviewed. The current challenges and prospects for further development are also discussed.

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Fast and Facile Liquid Metal Printing via Projection Lithography for Highly Stretchable Electronic Circuits

Wu,

Narongdej

et al. 2024

Advanced Materials

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Soft electronic circuits are crucial for wearable electronics, biomedical technologies and soft robotics, requiring soft conductive materials with high conductivity, high strain limit and stable electrical performance under deformation. Liquid metals (LMs) have become an attractive candidate with high conductivity and fluidic compliance, while effective manufacturing methods are demanded. Digital light processing (DLP)‐based projection lithography is a high‐resolution and high‐throughput printing technique for primarily polymers and some metals. If LMs can be printed with DLP as well, the entire soft devices can be fabricated by one printer in a streamlined and highly‐efficient process. Herein, we achieved fast and facile DLP‐based liquid metal printing. Simply with 5–10 seconds of patterned UV‐light exposure, a highly conductive and stretchable pattern can be printed using a photo‐crosslinkable LM particle ink. The printed eutectic gallium indium traces feature high resolution (∼20 μm), conductivity (3.0×106 S m−1), stretchability (∼2500%) and excellent stability (consistent performance at different deformation). Various patterns have been printed in diverse material systems for broad applications, including stretchable displays, epidermal strain sensors, heaters, humidity sensors, conformal electrodes for electrography, and multi‐layer actuators. The facile and scalable process, the excellent performance, diverse applications ensure its broad impact on soft electronic manufacturing.This article is protected by copyright. All rights reserved

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Thermal Transfer-Enabled Rapid Printing of Liquid Metal Circuits on Multiple Substrates

Cited by 28 publications

References 44 publications

Fabrication Approaches of Soft Electronics

Fabrication Approaches of Soft Electronics

Liquid metal enabled conformal electronics

Fast and Facile Liquid Metal Printing via Projection Lithography for Highly Stretchable Electronic Circuits

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