Thermal transfer influence of delamination in the die attach layer of chip-on-board LED package base on entropy generation analysis

Mo, Yuezhu; Yang, Daoguo; Cai, Miao; Liu, Dongjing; Nie, Yaoyao

doi:10.1109/icept.2016.7583216

Cited by 4 publications

(4 citation statements)

References 6 publications

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“…Extensive research has also attempted to elucidate the relationship between the defects and reliability characteristics of electronic devices, including interface failure effects on reliability [35][36][37], void effects of DA layers in LED packages [38][39][40][41][42][43] and DC-to-DC converters [44]. The degradation of heat transfer performance is one of the main causes of electronic package failure; hence, several studies tried to characterize the mechanism behind the degradation of heat transfer performance from the perspective of energy loss [10,45]. In 1D steady heat conduction, the equation for entropy generation through solids can be expressed as [46]…”

Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

“…which takes into account the integral of the temperature distribution and the thermal conductivity on the displacement. This method has been initially applied to evaluate the thermal conductivity of critical interfaces for high-power LEDs [45]. The heat transfer degradation of key interfaces has been studied by presetting the delamination in the edge and center of the DA layer.…”

Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

“…The heat transfer degradation of key interfaces has been studied by presetting the delamination in the edge and center of the DA layer. The dimensionless entropy generation value at the edge position corresponding to the delamination in the DA layer is significantly higher than that at the center position [45]. The evolution mechanism of crack length and the degradation of heat transfer performance have been further considered on the basis of entropy generation theory [15].…”

Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

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Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

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Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components.

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Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

Section: Entropy Methodologies For Microstructuresmentioning

confidence: 99%

See 1 more Smart Citation

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

Self Cite

View full text Add to dashboard Cite

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“…Poor heat dissipation can influence high-power LED's reliability such as the service life and the light efficiency [6][7][8]. And there are some papers showing that if the temperature of the LED device rises to 2 ∘ C, the reliability can be reduced 2%-10% [8,9]. The life will reduce 50% if the temperature of the LED device rise 10 ∘ C. [3].…”

Section: Introductionmentioning

confidence: 99%

Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

Zhang

Yin

2017

Advances in Materials Science and Engineering

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The reliability of high-power light-emitting-diode (LED) devices strongly depends on the die-attach quality because voids may increase junction temperature and total thermal resistance of LED devices. Die-attach material has a key role in the thermal management of high-power LED package by providing low-contact thermal resistance. Thermal and mechanical analyses were carried out by experiments and thermal simulation. The quantitative analysis results show that thermal resistance of die-attach layer (thermal resistance caused by die-attach material and voids in die-attach layer) plays an important role in total thermal resistance of high-power LED packaging according to the differential structure function of thermal transient characteristics. The increase of void fraction in die-attach layer causes the increases of thermal resistance of die-attach layer; the thermal resistance increased by 1.95 K/W when the void fraction increased to 62.45%. The voids also make an obvious influence on thermal stress and thermal strain of chip; the biggest thermal stress of chip was as high as 847.1 MPa compared to the 565.2 MPa when the void fraction increases from being void-free to 30% in the die-attach layer.

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Optimized design of high precision heating stage for die attach equipment

Yao

Wang

et al. 2017

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

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Thermal transfer influence of delamination in the die attach layer of chip-on-board LED package base on entropy generation analysis

Cited by 4 publications

References 6 publications

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

Optimized design of high precision heating stage for die attach equipment

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