Thermal transient characterization of semiconductor devices with multiple heat sources—Fundamentals for a new thermal standard

Schweitzer, Dirk; Ender, Ferenc; Hantos, Gusztáv; Szabó, Péter

doi:10.1016/j.mejo.2014.11.001

Cited by 49 publications

(25 citation statements)

References 5 publications

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“…In cooperation with Infineon we investigated how multi-heat source systems can be best described by the so called thermal resistance (impedance) characterization matrices and how elements of such a matrix can be identified by thermal transient measurements [36]. Another topic our team was engaged with was the further development of a measurement card using an array of miniature IR sensing devices which is aimed at IR mapping of boards of live system [37].…”

Section: Further Results Related To Thermal Characterizationmentioning

confidence: 99%

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

Vajk¹,

Harsányi

Poppe

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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PrefaceThroughout László Vajta, Dean of BME VIK János Levendovszky, Deputy Dean of BME VIK Department of Automation and Applied InformaticsDepartment of Automation and Applied Informatics (AUT) is one of the largest and dynamically developing departments at BME with diverse scope competences such as control theory, embedded systems, software modelling, applied software development, Internet of Things, power electronics, mechatronics, and many others. The department's main activities are education, research and development. Training versatile electrical and software engineers with solid practical knowledge is our top priority. Our profile also includes developing high quality software and hardware solutions for industry partners. All of our activities are backed by strong research background.In 2015, the department has organized the 21 st European Wireless (EW) Conference. The EW 2015 conference hosted more than 140 participants from 30 different countries. The 2015 edition of EW was aimed at addressing a key theme on "5G and beyond."The next sections summarize the key research results of the department in year 2015. IoT and Smart CityThe Internet of Things (IoT) is transforming the surrounding physical objects into an ecosystem of information that enriches our everyday life. The IoT represents the convergence of advances in miniaturization, wireless connectivity, and increased data storage, and is driven by various sensors. Application and service development methods and frameworks are required to support the realization of solutions covering data collection, transmission, data processing, analysis, reporting, and advanced querying. Our SensorHUB framework URBMOBI is a mobile environmental sensor that (i) provides temporally and spatially distributed environmental data, (ii) fulfills the need for monitoring at various places without the costs for a large number of fixed measurement stations, (iii) integrates small and precise sensors in a system that can be operated on buses, trams, or other vehicles, (iv) concentrates on urban heat and thermal comfort, and (v) aims at providing climate services and integration with real-time climate models.utilizes the state-of-the-art open source technologies and provides a unified tool chain for IoT related application and ser-URBMOBI project has been worked out between 2013 and 2015 by the following consortium: RWTH Aachen University (Germany), Netherlands Organization for Applied Scientific Research TNO (Netherlands), ARIA Technologies (France), Budapest University of Technology and Economics (Hungary), and Meteorological and Environmental Earth Observation (Italy).The SOLSUN (Sustainable Outdoor Lighting & Sensory Urban Networks) project is about to demonstrate how intelligent city infrastructure can be created in a cost-effective and sustainable way by reusing existing street lighting as the communications backbone. We apply different technologies and methods to reduce energy consumption at the same time as turning streetlights into nodes on a scalable network that is al...

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Section: Further Results Related To Thermal Characterizationmentioning

confidence: 99%

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

Vajk¹,

Harsányi

Poppe

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

View full text Add to dashboard Cite

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“…Following the terminology introduced by D. Schweitzer [9,10], let us call such nodes as driving points and/ or monitoring points. When a node is a driving point, it represents a time variant heat dissipating element.…”

Section: Sunred Algorithm With Transfer Functions Representing Thermamentioning

confidence: 99%

“…The number of driving points in a system is equal to the number of elementary heat-sources we have in the system. Since any location in the system can be a monitoring point, in a general case the number of monitoring points can be greater or equal to the number of driving points [10]. The "thermal coupling" (or heat propagation) between a driving point and a monitoring point is described by the thermal transfer impedance between these points.…”

Section: Sunred Algorithm With Transfer Functions Representing Thermamentioning

confidence: 99%

“…In the PROFIT approach first a steadystate thermal resistance network is generated which is then extended to a dynamic model by adding appropriate thermal capacitances. D. Schweitzer provided a detailed overview of the mathematical description of multi-heat source problems [9,10]. Though in this paper D. Schweitzer provides a general formulation of the problem and he established a terminology that we also try to follow in our present work, no mentioning of a compact thermal modeling methodology is given which is aimed at the description of multi heat-source problems with any geometrical arrangement and is not restricted to semiconductor device packages.…”

Section: Introductionmentioning

confidence: 99%

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Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Németh

Poppe

2018

Period. Polytech. Elec. Eng. Comp. Sci.

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In this paper we present a new, direct computational method for calculating thermal transfer impedances between two separate locations of a given physical structure, aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm.We tested the method symbolically with a simple 2D example with multiple combinations of Dirichlet and Neumann type boundary conditions. Also, for time domain transient analysis different types of thermal loads such as prescribed unit-step change in dissipation or temperature were assumed. A model of a typical MCPCB assembled LED was also created. With that model we studied the inverse problem of predicting the thermal conditions at the junction (the "driving point") from the transient signal measured at the thermal test point on the MCPCB (the "monitoring point") which is a typical task in simple LED thermal management designs. Results obtained by the proposed new calculation method and results obtained by conventional numerical simulations differ less than the uncertainty of the traditional solution method itself. The drawback of the accuracy is the high computational cost. This increased computational need can be mitigated by introducing the combination of the balanced model reduction and the SUNRED algorithms. Keywords

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“…Existing multi-domain modeling procedures with N subsequent CFD simulations can provide a good solution for analyzing the effects of LED variations at system level, but a fast modeling method for achieving a precise T j of LED luminaires is still an urgent need. Following the concept of multi-domain modeling [35], [36] and [38], this work aims to provide a simple modeling method to predict a precise luminaire T j quickly.…”

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confidence: 99%

Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method

et al. 2019

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Thermal transient characterization of semiconductor devices with multiple heat sources—Fundamentals for a new thermal standard

Cited by 49 publications

References 5 publications

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method

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