Thermally Annealed Tantalum-filled Vertical Superconducting Interconnects for Scalable Quantum Computing Systems

Mishra, Harsh; Bonam, Satish; Pandey, Ullas; Singh, Shiv Govind

doi:10.1109/eptc59621.2023.10457669

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2024

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Cited by 2 publications

References 21 publications

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Novel Wafer-Level Ta-Ta Direct Thermocompression Bonding for 3D Integration of Superconducting Interconnects for Scalable Quantum Computing System

Mishra,

Bonam,

Kumar

et al. 2024

IEEE Electron Device Lett.

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Novel Wafer-Level Ta-Ta Direct Thermocompression Bonding for 3D Integration of Superconducting Interconnects for Scalable Quantum Computing System

Mishra,

Bonam,

Kumar

et al. 2024

IEEE Electron Device Lett.

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Superconducting Devices: From Quantum Computing to Energy Transmission

Hassan

2024

Superconductivity - Physics and Devices [Working Title]

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Superconducting devices, leveraging the unique properties of zero resistance and the Meissner effect, are transforming diverse technological fields. This chapter explores their applications, from quantum computing to energy transmission and medical imaging. Superconducting quantum computers, employing superconducting qubits and circuits, promise breakthroughs in computing power and speed due to longer coherence times, higher fidelity, and reduced noise. Superconductors revolutionize energy transmission by enabling lossless energy transfer through high-current carrying cables, thus enhancing grid efficiency and reducing energy waste. Additionally, superconducting magnetic energy storage (SMES) systems offer efficient and rapid energy storage for grid stabilization and renewable energy integration. Superconducting technology significantly enhances medical imaging, particularly Magnetic Resonance Imaging (MRI), by enabling the generation of powerful magnetic fields, leading to clearer images and faster scan times. Despite challenges in cost and material limitations, ongoing research aims to overcome these hurdles, paving the way for wider adoption of these transformative technologies.

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Thermally Annealed Tantalum-filled Vertical Superconducting Interconnects for Scalable Quantum Computing Systems

Cited by 2 publications

References 21 publications

Novel Wafer-Level Ta-Ta Direct Thermocompression Bonding for 3D Integration of Superconducting Interconnects for Scalable Quantum Computing System

Novel Wafer-Level Ta-Ta Direct Thermocompression Bonding for 3D Integration of Superconducting Interconnects for Scalable Quantum Computing System

Superconducting Devices: From Quantum Computing to Energy Transmission

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