Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability

Abstract

Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices.

Instant interfacial self-assembly for homogeneous nanoparticle monolayer enabled conformal “lift-on” thin film technology

“…Lithography-based thin film fabrication, a widely used technique in microdevice engineering ( 40 ), has ongoing limitations such as the high process cost and the use of complicated template ( 41 ). In this work, scale-up assembly of NPs in 2D films provides an alternative by coating 2D monolayer film on arbitrary substrate via a two-step process ( 42 ).…”

Conformation-modulated three-dimensional electrocatalysts for high-performance fuel cell electrodes

“…The large-area capability indicates that the process can be directly applied to real industry, beyond laboratory-scale systems. Furthermore, our group demonstrated a sputtering-based nTP process ( 23 ), in which mass activity can be greatly improved through application of Pt alloy materials via a sputtering process.…”

Large Area Patterning of Nanoparticles and Nanostructures: Current Status and Future Prospects

“…After the first report, various innovative nTP techniques have been reported including transfer to nonplanar and flexible substrates. , Very recently, transferred patterns with sub-20 nm resolution and 8 in. wafer scalability were achieved . Further development will enable some special functionalities of materials or devices by removing the constraints of patterning materials and substrates.…”

“…wafer scalability were achieved. 122 Further development will enable some special functionalities of materials or devices by removing the constraints of patterning materials and substrates.…”